THERM-A-GAP™ GEL 37 High Performance Fully Cured Dispensable GEL

PublishTime：2020-11-18

Parker Chomerics THERM-A-GAP GEL 37 is a high performance, one component, dispensable thermal interface material with 3.7 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 37 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses. It is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.
Features and Benefits:
●Thermal conductivity: 3.7 W/m-K
●Easily dispensed
●No secondary curing required
●Low thermal impedance
●Ultra-low compression force
●Reworkable

Brand of Product：	Parker Chomerics
Part#：	THERM-A-GAP™ GEL 37 、 GEL 37 、 THERM-A-GAP GEL 37 、 65-00-GEL37-0010 、 65-02-GEL37-0030 、 65-02-GEL37-0180 、 65-00-GEL37-0300 、 65-1P-GEL37-2500 、 65-5P-GEL37-7500 More Part#
Product Category：	High Performance Fully Cured Dispensable GEL More
Application：	[ Telecom base stations ][ Power supplies ][ semiconductors ][ Memory and power modules ][ Microprocessors ][ Central processing units ][ CPUs ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	June 202
Version Number：
Data Encoding：
Data Size：	301 KB

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