THERM-A-GAP™ GEL 75 Reliability Report (TR1103)
●THERM-A-GAP™ GEL 75 is a high-performance, one-component, fully-cured dispensable thermally conductive gel. The paste-like consistency enables superior performance and long- term thermal stability. This material is designed to be dispensed in applications requiring low compressive forces and minimal thermal resistance for maximal thermal performance. This document outlines the examination of the thermal reliability of this high-performance gap filler after being subjected to long-term environmental aging under dry heat, heat & humidity conditions, and temperature cycling from -40°C to 125°C.
●The thermal performance of THERM-A-GAP™ GEL 75 was examined after being subjected to multiple environmental stress tests. The thermal impedance of the aged samples did not experience a significant increase after any of the treatments studied. After 1000-hour dwell at 125°C, 1000 hours at 85°C/85% relative humidity, and 1000 temperature cycles from -40°C to 125°C, there was no statistically significant change in impedance according to one-way ANOVA with the Tukey method for multiple comparisons. The mean value for thermal impedance decreased slightly for each aging treatment, indicating an improvement in thermal performance.
●For vibration testing GEL 75 was dispensed and compressed at 0.010” and 0.040” gap thicknesses. Post compression, samples were subjected to an overall power spectral density of 2.0 grms while being subjected to a thermal cycling profile that reached a minimum temperature of -40°C and maximum temperature of 105°C.
●The results show minimal displacement / cracking of the gel samples from their original compressed location within the test fixture.
●Based on these results, THERM-A-GAP™ GEL 75 demonstrates the ability to withstand long-term aging without a reduction in performance.
|
|
|
|
Test Report |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
MARCH 2022 |
|
|
Rev. B |
|
|
TR1103 |
|
|
2.5 MB |
- +1 Like
- Add to Favorites
Recommend
- New THERM-A-GAP GEL 75 Thermal Gel Offers High Thermal Conductivity and Reliability
- Parker Chomerics‘ THERM-A-GAP™ Gel 20 One-component Thermal Interface Material with 2.4W/m-k Thermal Conductivity Ideal for Automotive Industry Applications
- Parker Releases High-Flow Thermal Gel THERM-A-GAP™ GEL 60HF Offering Flow Rates of up to 100g/min for High-Volume Applications
- 5.2W/m-K High Reliability, Fully Cured, Dispensable Thermal Gel from Parker Chomerics
- On the Cutting Edge: How Parker Chomerics Helps SpaceX Soar
- News | Thermal Interface Materials for Challenging Private Spaceflight Applications
- High-Performance Thermal Gap Filler Pads to Further Optimise Heat Transfer Applications in Electronic Systems
- QSFP-DD Optical Transceiver Thermal Interface Materials with Greater Density, Greater Heat
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
