THERM-A-GAP™ GEL 35VT Reliability Report (TR 58940)
●THERM-A-GAP™ GEL 35VT is a one-component, dispensable thermal interface gel material with 3.5 W/m-K thermal conductivity. It was developed to conduct heat from electronics to heat sinks or enclosures and perform reliably in vertical, high vibration, and harsh environments. The “VT” suffix in the product name stands for “vibration/vertical and tackiness” as this material was thoroughly tested during development to withstand rigorous reliability testing within vibration and vertical slump testing.
●THERM-A-GAP GEL 35VT requires no mixing or secondary curing and is designed for easy application and rework. The tackiness of GEL 35VT serves the added benefit of displacing air at thin bond lines and minimizing thermal impedance. It can be dispensed at various bond line thicknesses to take up gaps created by assembly or manufacturing tolerances. This document outlines the examination of the thermal reliability of this high-performance gap filler after being subjected to long-term environmental aging under dry heat, heat & humidity conditions, and temperature cycling from -40°C to 125°C.
●The thermal performance of THERM-A-GAP™ GEL 35VT was examined after being subjected to multiple environmental stress tests.
●The thermal impedance of the aged samples did not experience a significant increase after any of the treatments studied. After 1000-hour dwell at 125°C, 1000 hours at 85°C/85% relative humidity, and 1000 temperature cycles from -40°C to 125°C, there was no statistically significant increase in impedance according to one-way ANOVA with the Tukey method for multiple comparisons. The mean value for thermal impedance decreased slightly for each aging treatment, indicating an improvement in thermal performance. This improvement can likely be attributed to enhanced wetting at the interface between the gel and the reliability fixture.
●Based on these results, THERM-A-GAP™ GEL 35VT demonstrates the ability to withstand long- term aging without a reduction in thermal performance.
|
[ electronics ] |
|
|
Test Report |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
May 2023 |
|
|
|
|
|
TR 58940 |
|
|
907 KB |
- +1 Like
- Add to Favorites
Recommend
- Parker Chomerics‘ THERM-A-GAP™ Gel 20 One-component Thermal Interface Material with 2.4W/m-k Thermal Conductivity Ideal for Automotive Industry Applications
- Parker Releases High-Flow Thermal Gel THERM-A-GAP™ GEL 60HF Offering Flow Rates of up to 100g/min for High-Volume Applications
- New THERM-A-GAP GEL 75 Thermal Gel Offers High Thermal Conductivity and Reliability
- 5.2W/m-K High Reliability, Fully Cured, Dispensable Thermal Gel from Parker Chomerics
- On the Cutting Edge: How Parker Chomerics Helps SpaceX Soar
- News | Thermal Interface Materials for Challenging Private Spaceflight Applications
- High-Performance Thermal Gap Filler Pads to Further Optimise Heat Transfer Applications in Electronic Systems
- QSFP-DD Optical Transceiver Thermal Interface Materials with Greater Density, Greater Heat
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
