THERM-A-GAP™ GEL 75 High Performance Fully Cured Dispensable GEL
●The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 75 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.
●It is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.
●Product Features
■Thermal conductivity: 7.5 W/m-K
■Easily dispensed
■No secondary curing required
■Low thermal impedance
■Very low compression force
■Reworkable
|
THERM-A-GAP™ GEL 75 、 THERM-A-GAP GEL 75 、 GEL 75 、 65-00-GEL75-0010 、 65-02-GEL75-0030 、 65-02-GEL75-0180 、 65-00-GEL75-0300 、 65-1P-GEL75-2500 、 65-5P-GEL75-7350 |
|
|
High Performance Fully Cured Dispensable GEL 、 high performance, one component, dispensable thermal interface material |
|
|
[ Telecom base stations ][ Power supplies ][ semiconductors ][ Memory modules ][ power modules ][ Microprocessors ][ Central processing units ][ CPUs ][ automated dispensing machines ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
February 2023 |
|
|
|
|
|
CHODS1025 |
|
|
522 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
