THERM-A-GAP™ GEL 75 High Performance Fully Cured Dispensable GEL
●The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 75 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.
●It is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.
●Product Features
■Thermal conductivity: 7.5 W/m-K
■Easily dispensed
■No secondary curing required
■Low thermal impedance
■Very low compression force
■Reworkable
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THERM-A-GAP™ GEL 75 、 THERM-A-GAP GEL 75 、 GEL 75 、 65-00-GEL75-0010 、 65-02-GEL75-0030 、 65-02-GEL75-0180 、 65-00-GEL75-0300 、 65-1P-GEL75-2500 、 65-5P-GEL75-7350 |
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High Performance Fully Cured Dispensable GEL 、 high performance, one component, dispensable thermal interface material |
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[ Telecom base stations ][ Power supplies ][ semiconductors ][ Memory modules ][ power modules ][ Microprocessors ][ Central processing units ][ CPUs ][ automated dispensing machines ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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February 2023 |
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CHODS1025 |
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522 KB |
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