THERM-A-GAP™ GEL 37 High Performance Fully Cured Dispensable GEL

2023-12-05
●Parker Chomerics THERM-A-GAP GEL 37 is a high performance, one component, dispensable thermal interface material with 3.7 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure.
●The material's heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 37 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.
●It is formulated to accommodate today's high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.
●Product Features
■Thermal conductivity: 3.7 W/m-K
■Easily dispensed
■No secondary curing required
■Low thermal impedance
■Very low compression force
■Reworkable

Parker Chomerics

GEL 3765-00-GEL37-001065-02-GEL37-003065-02-GEL37-018065-00-GEL37-030065-1P-GEL37-2500THERM-A-GAP™ GEL 37THERM-A-GAP GEL 37

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High Performance Fully Cured Dispensable GELhigh performance, one component, dispensable thermal interface material

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Telecom base stations ]Power supplies ]semiconductors ]Memory ]power modules ]Microprocessors ]Central processing units ]CPUs ]

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November 2023

CHODS1026

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