CHOFORM® and ParPHorm® Robotically Dispensed Form-In-Place EMI Gaskets
Parker Chomerics CHOFORM Automated EMI
Gasketing System is ideal for today’s densely
populated electronics packaging, particularly where intercompartmental isolation is
required to separate processing and signal
generating functions. CHOFORM is directly dispensed on castings, machined metal
and conductive plastic housings and board
shields. It provides excellent electrical contact to mating conductive surfaces including printed circuit board traces. CHOFORM
is widely used in compartmentalized enclosures and other tightly packaged electronic
devices in military, telecom, transportation,
aerospace and life science applications.
Selection catalogue
|
19-26-1800-0345 、 19-26-1938-0200 、 19-26-1945-0250 、 19-26-5513-0850 、 19-26-5526-0850 、 19-26-5528-0850 、 19-26-5538-0650 、 19-26-5541-0650 、 19-26-5550-0575 、 19-26-5560-0500 、 19-26-5575-0240 、 19-26-5575-0500 、 CCHOFORM 5550 、 CHOFORM 5513 、 CHOFORM 5526 、 CHOFORM 5528 、 CHOFORM 5538 、 CHOFORM 5541 、 CHOFORM 5560 、 CHOFORM 5575 、 CHOFORM®5513 、 CHOFORM®5526 、 CHOFORM®5528 、 CHOFORM®5538 、 CHOFORM®5541 、 CHOFORM®5550 、 CHOFORM®5560 、 CHOFORM®5575 、 ParPHorm 1800 、 ParPHorm L1938 、 ParPHorm S1945 、 ParPHorm®1800 、 ParPHorm®L1938-45 、 ParPHorm®S1945-25 |
|
|
Robotically Dispensed Form-In-Place EMI Gaskets 、 Conductive Form-In-Place Gaskets 、 Non-Conductive Form-In-Place Gaskets |
|
|
[ military ][ telecom ][ transportation ][ aerospace ][ life science ] |
|
|
Selection guide |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
October 2018 |
|
|
|
|
|
|
|
|
18.1 MB |
- +1 Like
- Add to Favorites
Recommend
- On the Cutting Edge: How Parker Chomerics Helps SpaceX Soar
- Sekorm Became an Authorized Distributor of Parker Chomerics
- 5.2W/m-K High Reliability, Fully Cured, Dispensable Thermal Gel from Parker Chomerics
- PARKER CHOMERICS New Electrically Conductive Sealant CHO-BOND 1018 Offers Unique Combination: Galvanic Compatibility to Aluminium and Fluid/Fuel Resistance
- Parker Chomerics‘ THERM-A-GAP™ Gel 20 One-component Thermal Interface Material with 2.4W/m-k Thermal Conductivity Ideal for Automotive Industry Applications
- News | Thermal Interface Materials for Challenging Private Spaceflight Applications
- Easy-access CAD Models for Conductive Elastomer Extrusion Profiles Help Accelerate Design Cycles
- Parker’s New Critical Protection (CP) Hose Cover Extends Service Life in the Toughest Environments
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
