Thermal Interface Material Dispensing Guide
●Parker Chomerics thermal interface material dispensable products are ideal solutions for today’s electronic packages. Thermally conductive, dispensable materials have the ability to cover a variety of gaps and form complex geometries.
●This ability to conform provides reduced thermal contact resistances and thus reduces the temperature and increases the efficiency of the electronic application, while providing low closure force. When using dispensable products, specifiers should consider factors such as pump equipment, mating surfaces, tolerance stack up, closure force and physical application of the material.
Selection catalogue
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Gel 45 、 Gel 8010 、 Gel 37 、 TC 50 、 Gel 30 、 T636 、 T635 、 T630 、 Gel 25NS 、 T642 、 1642 、 T647 、 1641 、 T646 、 CIP 35 、 T660 、 T650 、 T670 、 Gel 75 |
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Thermal Interface Material 、 Thermally Conductive Gels 、 Cure-in-Place Potting Compounds 、 Thermal Greases 、 TIM |
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[ Automotive electronic control unit ][ ECU ][ Engine ][ braking controls ][ traction controls ][ Power conversion equipment ][ Power supplies ][ uninterruptable power supplies ][ Power semiconductors ][ MOSFET arrays ][ Televisions electronics ][ consumer electronics ][ LED modules ][ power drivers ][ Telecom base stations ][ Microprocessors ][ mobile servers ][ desktops ][ Memory modules ][ DC/DC converters ][ Telecom base station ][ high-volume automated dispensing systems ][ dispensing equipment ] |
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Selection guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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May 2021 |
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1006 |
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1.9 MB |
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