Parker Chomerics Electrically Conductive Silicone Adhesive / Sealant Application Procedure
This application procedure applies to Parker Chomerics electrically conductive, silicone, one part room temperature vulcanizing (RTV) and two part systems.Specifically addressed are CHO-BOND® 1029 and 1030 adhesives; CHO-BOND 1016, 1035, 1038, 1075, 1121 and Tecknit 0002 sealants;and CHO-SHIELD 1085 and 1086 primers.
It is assumed that the substrates to be adhered / sealed are chem filmed aluminum, per MIL-DTL-5541, Type I or II,Class 3. If this is not the case, please contact Parker Chomerics Applications Engineering (781) 935-4850 to review the surface preparation for your particular substrates.
|
CHO-BOND 1029 、 CHO-BOND 1030 、 CHO-BOND 1016 、 CHO-BOND 1035 、 CHO-BOND 1038 、 CHO-BOND 1075 、 CHO-BOND 1121 、 Tecknit 0002 、 250A 、 CHO-SHIELD 1086 、 CHO-SHIELD 1085 、 1035 、 1038 、 1075 、 1121 、 1086 、 CHO-BOND® 1029 、 1030 |
|
|
|
|
|
Application note & Design Guide |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
January 2014 |
|
|
|
|
|
AN 1017 EN |
|
|
297 KB |
- +1 Like
- Add to Favorites
Recommend
- PARKER CHOMERICS New Electrically Conductive Sealant CHO-BOND 1018 Offers Unique Combination: Galvanic Compatibility to Aluminium and Fluid/Fuel Resistance
- On the Cutting Edge: How Parker Chomerics Helps SpaceX Soar
- Sekorm Became an Authorized Distributor of Parker Chomerics
- 5.2W/m-K High Reliability, Fully Cured, Dispensable Thermal Gel from Parker Chomerics
- Advanced Battery Energy Storage Systems (BESS) Solutions: Parker Chomerics 6.0W/m-K THERM-A-FORM CIP 60
- Parker Chomerics THERM-A-FORM CIP 60: 6.0W/m-K Dispensable Thermal Cure-in-Place and Gap Filler Material
- Parker Chomerics‘ THERM-A-GAP™ Gel 20 One-component Thermal Interface Material with 2.4W/m-k Thermal Conductivity Ideal for Automotive Industry Applications
- Easy-access CAD Models for Conductive Elastomer Extrusion Profiles Help Accelerate Design Cycles
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
