THERM-A-GAP™ GEL 37 NEW PRODUCT INTRODUCTION

2020-11-18
Introducing THERM-A-GAP GEL 37
●Next generation of dispensable thermal interface materials
●Improved flow rate control –better than GEL 30
●3.7 W/m-K thermal conductivity
●Single component, pre-cured material eliminates time consuming hand assembly, decreasing installation costs

Parker Chomerics

THERM-A-GAP™ GEL 37THERM-A-GAP GEL 37THERM-A-GAP T630THERM-A-GAPT635THERM-A-GAPT636THERM-A-GAP GEL 20THERM-A-GAPGEL 8010THERM-A-GAPGEL30THERM-A-GAPGEL 45THERM-A-GAPTC50THERM-A-GAPT657GEL 3765-00-GEL37-001065-02-GEL37-003065-02-GEL37-018065-00-GEL37-030065-1P-GEL37-250065-5P-GEL37-7500

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THERM-A-GAP GEL

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Telecom Market ]Automotive Market ]telecom 5G systems ]Flash memory ]5G base stations ]5G components ]antennas ]receivers ]consumer electronics ]Infotainment systems ]ADAS ]EV charging ]drive systems ]ECUs ]inverter/converters ]

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Supplier and Product Introduction

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