Current carrying capability of solder and press-fit pins
■This application note investigates the current carrying capability of a standard solder able pin and a Press-fit pin for Vincotech’s power modules. The measurements are carried out on an application board with boundary conditions comparable to real application.
●Introduction
■The Press-fit pin technology is a solder-less connection method, which ensures reliable mechanical and electrical contact. The Press-fit pin design contain a mechanism that allows plastic deformation when the pin enters the hole and creates a highly reliable, well accepted, gas tight cold-welded connection.The Press-fit pin was developed as a one-to-one replacement for the solder pin. This means that all Vincotech power modules can easily be equipped with the Press-fit pin and do not require a PCB layout change by the customer.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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June 2021 |
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Rev. 01 |
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374 KB |
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