Handling Instructions for flow S3 packages

2021-03-12
This document is valid for all type of flow S3 modules: 12 mm, Press-fit and Solder pins, thin ceramic.
The flow S3 type modules have to be mounted to a PCB. The electrical connections between module and the PCB made by using soldering or Press-fit technology. In applications where the module is attached to a heat sink,the PCB must also be attached to this heat sink. 1. Figure shows how this attachment can be achieved with threaded spacers.

Vincotech

B0-SP07BBA300S501-LM46L58T-/6/

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flow S3 modules

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User's Guide

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07.01.2021

Rev. 03

3 MB

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