New flow S3 Mid-Power Package - the Smarter Way
The new base plate-less flow S3 package extends the power range of Vincotech's well established flow housing family.The housing is tailored for applications demanding more power in small footprint for example solar inverters or motor drives.
Introduction:
Engineers aim for higher power ratings, increased power density and, ultimately, more power in the same frame size. An increase of ceramic substrate size to accommodate the required semiconductors for higher power rating, while keeping a small package foot print,is the key.The sweet spot comes by lack of a copper base plate and by lack of system solder,which results reduced cost and increased reliability. A new base plate-less package with single big ceramic substrate will be introduced in this article.
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[ solar inverters ][ motor drives ] |
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2020/05/16 |
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654 KB |
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