IRFE9230 REPETITIVE AVALANCHE AND dv/dt RATED HEXFET® TRANSISTORS SURFACE MOUNT (LCC-18)
●Description
■The leadless chip carrier (LCC) package represents the logical next step in the continual evolution of surface mount technology. Designed to be a close replacement for the TO-39 package, the LCC will give designers the extra flexibility they need to increase circuit board density. IR HiRel has engineered the LCC package to meet the specific needs of the power market by increasing the size of the bottom source pad, thereby enhancing the thermal and electrical performance. The lid of the package is grounded to the source to reduce RF interference.
●Features
■Surface Mount
■Small Footprint
■Alternative to TO-39 Package
■Hermetically Sealed
■Dynamic dv/dt Rating
■Avalanche Energy Rating
■Simple Drive Requirements
■Light Weight
■ESD Rating: Class 1C per MIL-STD-750, Method 1020
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Datasheet |
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Please see the document for details |
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LCC-18 |
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English Chinese Chinese and English Japanese |
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2019-03-26 |
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PD-91717D |
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2.3 MB |
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