Optimal Electronics Design through PHOENIXCONTACT Thermal Simulation for Device Developers
Online thermal simulation from Phoenix Contact offers new possibilities for the suitable design of industrial electronics as early as the development phase.
The procedure for initiating the thermal simulation is intuitive. In the first step, the customer configures their housing (including the required connection technology) in the online housing configurator. They then receive a parts list, 3D data, and the PCB outline of the configuration. The customer now switches to the online simulation interface. The thermal boundary conditions of the device are defined here. This includes the installation situation (mounting position, possible neighboring devices) as well as the ambient temperature.
In the next step, the customer can use drag and drop to place up to three different hot spots on the PCB, assign them a geometry, and enter the expected power dissipation. The simulation is then sent with the customer data input. Within three working days, the simulation result for the individual load case is available as a 3D PDF. The Phoenix Contact team is also able to provide additional advice.
- +1 Like
- Add to Favorites
Recommend
- Thermal Grizzly CPU Contact Frame Intel 1700 LT is Now Available
- Thermal Grizzly Product Update: AM5 High-Performance Heatspreader with New Nickel Plating
- What is Thermal Simulation and Why is it Important to Reliability Burn-in Testing?
- Why Does Thermal Resistance Affect the Thermal Conductivity of Thermal Silicone Pad?
- New THERM-A-GAP GEL 75 Thermal Gel Offers High Thermal Conductivity and Reliability
- Laird Thermal Systems’ PowerCycling PCX Series Thermoelectric Cooler Features a Unique Construction That Reduces Thermal Stresses in Thermal Test Sockets
- Parker Chomerics‘ THERM-A-GAP™ Gel 20 One-component Thermal Interface Material with 2.4W/m-k Thermal Conductivity Ideal for Automotive Industry Applications
- The Next Generation of Thermal Gap Filler Pad: THERM-A-GAP PAD 80LO, with a Thermal Conductivity of 8.3 W/m-K
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
