Thermal Grizzly Prepared Four New Products for Intel’s Arrow Lake Processors
With the introduction of the Intel Core Ultra nomenclature, the names of the new Intel processors are not the only things changing. Instead of the 15th generation of Intel Core CPUs, we can now look forward to the Intel Core Ultra 200 processor series. Along with the new name comes a new socket and corresponding new motherboards. The new LGA1851 socket is not compatible with the LGA1700 socket, so we have prepared four new products at launch to help PC enthusiasts make the transition to the new platform.
Intel 1851 CPU Contact Frame V1
In addition to a new internal contour for the contact surface, the new Intel 1851 CPU Contact Frame V1 considers the position of the socket on the motherboard. The thermal hotspot has shifted with the Arrow Lake CPUs and is now located further north compared to its predecessor. With a slight shift of Socket 1851 compared to LGA1700, Intel has attempted to counter the hotspot shift. Thus, CPU coolers designed for Socket 1700 can also be used with Socket 1851. The shift in the socket makes previous contact frames for Socket 1700 incompatible with 1851, which is why thermal grizzly now offers the Intel 1851 Contact Frame V1.
Intel 1851 Mycro Direct-Die PRO RGB V1
The Intel 1851 Mycro Direct-Die PRO RGB V1 microfin water cooler for the new Intel CPUs will be available in the familiar black aluminum cover on Plexiglass design as well as in a white and silver version. The black version of the cooler will be available soon, while the white/silver special edition will be available in approximately six weeks.
The Intel 1851 Delid-Die-Mate V1 will also be available at the launch of the Arrow Lake CPUs, allowing PC enthusiasts to delid their CPUs right away. A separate blog post will be published soon about delidding Intel Arrow Lake CPUs and the associated risks.
Intel 1851 Delid-Die-Mate Heater V1
Since delidding Core Ultra 200 CPUs is riskier than with previous Intel CPUs, it is highly recommended to heat the processor to around 165℃ when delidding. This liquefies the indium solder and minimizes mechanical stress on the chip. The Intel 1851 Delid-Die-Mate Heater V1 was specifically developed for this purpose and will be available in about 2-3 weeks.
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