SolderCore™8ULP Computer On Module with NXP i.MX 8ULP
■F&S is offering boards with connectors for more than 20 years. In addition, a "direct soldering module" according to the OSM standard is now also offered. Based on the experience with this solderable module, the SolderCore module was developed. This makes it possible to connect all important interfaces to a carrier board with a module that is only 35x35mm in size. The extremely power-saving SoC i.MX8ULP is particularly suitable for portable, battery-operated devices. A small, compact module is therefore the ideal solution for this CPU.
■Despite the low power consumption, the CPU offers considerable GPU power (2D and 3D).
■The SoM is available in both consumer and industrial versions.
●Characteristics
■NXP i.MX 8ULP applications processor 1-2x Cortex®-A35- 1GHz & -M33- 216MHz HIFI4 DSP – 600MHz 2D/ 3D GPU OpenGL/CL 3.1
■2GB LPDDR4x32 RAM, 32GB eMMC
■24 bit RGB, MIPI-DSI 4 lanes, EPDC (EInk)
■MIPI-CSI
■2x USB 2.0 OTG, 1x LAN, FlexCAN, 2x SDIO
■133x GPIO, these can be used alternatively:
■4x+4x UART, 4x+2x I²C, 2x I³C, 2x+2x SPI, 6x+6x I2S
■Linux (Yocto)
■5V (tbd typ.)/ 4.2V Battery, 220 Solder Pads
■35 x 35mm
■0°C - +70°C (-40°C - +85°C opt.)
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SolderCore™8ULP 、 SolderCore™8ULP-V1-LIN 、 SolderCore™8ULP-SKIT-LIN 、 SolderCore8ULP-V1-LIN 、 SolderCore8ULP 、 SolderCore8ULP-SKIT-LIN |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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April 2023 |
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479 KB |
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