GR533x Hardware Design Guidelines

2024-01-10
■Purpose
●This document presents the necessary circuit required for proper operation of GR533x Bluetooth System-on-Chips (SoCs). Recommended chip interfaces, peripherals, schematic diagram, and PCB layout guidelines of the GR533x SoC family are provided.
●This Hardware Design Guidelines intends to help system designers build minimal Bluetooth Low Energy (Bluetooth LE) hardware circuits and develop Bluetooth products.
■Product Overview
●The Goodix GR533x series is a Bluetooth Low Energy (Bluetooth LE) 5.3 System-on-Chip (SoC), suitable for Internet of Thing (IoT) applications, supporting Bluetooth mesh networking protocols.
●Based on Arm® Cortex®-M4F CPU core running at 64 MHz, the GR533x integrates a 2.4 GHz RF transceiver, Bluetooth LE 5.3 protocol stack, 512 KB on-chip Flash memory, 96 KB system SRAM, and a rich set of peripherals. It provides excellent RF performance, with a maximum of +15 dBm TX power, -99 dBm RX sensitivity and a maximum of 114 dB link budget in Bluetooth LE 1 Mbps mode.
●With two main power supply schemes (DC-DC and system LDO), the GR533x offers flexible options to achieve a balance between low power consumption and economical BOM.
●GR533x devices are offered in both QFN32 and QFN48 packages. The following table lists the detailed package configurations.

GOODIX

GR533xGR533x seriesGR5331AENIGR5331CENIGR5332AENEGR5332CENE

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Part#

Bluetooth System-on-ChipsSoCsBluetooth Low Energy 5.3 System-on-ChipBluetooth LE 5.3 SoC

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Application note & Design Guide

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Please see the document for details

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QFN32;QFN48

English Chinese Chinese and English Japanese

2023-11-14

Version: 1.1

2.9 MB

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