A1007F9-2XX2XX0 1.00mm Pitch Wafer H=3.9 SMT R/A D/R TYPE
■MATERIAL SPECIFICATION:
▲HOUSING: LCP, UL94V-0
▲CONTACTS: COPPER ALLOY
▲SOLDER TABS: COPPER ALLOY
■PLATING SPECIFICATION:
▲CONTACTS: TIN/GOLD FLASH PLATED OVER ALL.
▲SOLDER TABS: TIN PLATED ON NICKEL OVERALL.
■MECHANICAL PERFORMANCE:
▲RETENTIVITY FORCE: 1.5KGF/Pin Min
▲DURABILITY: 20 CYCLES.
■ELECTRICAL PERFORMANCE:
▲CURRENT RATING: 1A AC/DC
▲RATED VOLTAGE : 500V AC/DC
▲CONTACT RESISTANCE: 20 mΩ MAX
▲INSULATION RESISTANCE: 100MΩ Min
▲DIELECTRIC WITHSTANDING : 500V
■ENVIRONMENTAL PERFORMANCE:
▲OPERATING TEMPERATURE: -25°C~ + 85°C.
▲SALT SPRAY: 12 H
■PACKAGE SPEC: REEL
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Product Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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22.10.28 |
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REV: A0 |
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229 KB |
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