THERM-A-GAP™ GEL 60HF High Performance High Flow Rate Fully Cured Dispensable GEL

2023-05-18
●Customer Value Proposition
■THERM-A-GAP GEL 60HF is part of the Parker Chomerics family of fully cured, one component, silicone-based, dispensable thermal interface materials. With a 6.2 W/m-K thermal conductivity, it is designed for high performance heat transfer from electronics components to cooling features and meant to be used across industries and applications.
■The “HF” in GEL 60HF stands for “High Flow”, indicating that the material is ideal for high volume dispensing applications and high throughput production operations. As with all Parker Chomerics thermal gels, it is optimized for automated dispensing at various packaging sizes while retaining properties for easy rework and field repair situations.
■The paste-like consistency of THERMA- GAP GEL 60HF enables very tightly controlled dispensing and accurate material placement during assembly. It requires low compressive force to deflect under assembly pressure, subjecting components, solder joints and PCB leads to minimal stress.
●Product Features
■Thermal conductivity: 6.2 W/m-K
■High flow rate: 80g/min
■No secondary curing required
■Low thermal impedance
■Very low compression force
■Reworkable
■Single component
■Room temperature storage

Parker Chomerics

THERM-A-GAP™ GEL 60HFTHERM-A-GAP GEL 60HFGEL 60HF65-00-GEL60HF-001065-02-GEL60HF-003065-02-GEL60HF-018065-00-GEL60HF-030065-1P-GEL60HF-250065-5P-GEL60HF-750065-00-GEL60HF-0010-B65-02-GEL60HF-0030-B65-02-GEL60HF-0180-B65-00-GEL60HF-0300-B65-1P-GEL60HF-2500-B65-5P-GEL60HF-7500-B

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Part#

High Performance High Flow Rate Fully Cured Dispensable GELfully cured, one component, silicone-based, dispensable thermal interface materials

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Consumer electronics ]Telecommunications equipment ]Energy storage devices ]Power electronics ]modules ]Automotive control units ]sensors ]Computing components ]CPUs ]GPUs ]memory ]

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Datasheet

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January 2023

CHODS1051

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