CoreEZ® semiconductor package

PublishTime：2022-11-10

■CoreEZ® semiconductor package uses the HyperBGA® manufacturing platform to offer a thin core build up flip chip package with very dense core vias using a cost sensitive material set. The core via density provides 199 micron via to via core pitch, resulting in an essentially coreless structure.
■High core via density is achieved using smaller pads and the same 50 micron laser drilled holes used in producing HyperBGA® to unblock wiring channels through the core. This enables CoreEZ® to provide up to twice the number of signal layers as a standard build up package that uses mechanically drilled core vias with large capture pads.
■The end result is an extremely cost effective solution that allows full strip line signal layers on both sides of the core. Component cost is further reduced by enabling die shrink through die pad pitch reduction down to 150 microns.
■In addition, the thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the PCB.
■CoreEZ® is an excellent choice for applications requiring low cost build up materials along with high reliability, performance and wireability. It is also well suited to aerospace applications requiring radiation tolerance.
●DESCRIPTION
■Up to 12 layer Particle Filled Epoxy Substrate
■Great solution for PCBA to SiP redesigns
■Very dense core vias (<200 micron pitch)
■50 micron UV laser drilled vias
■25 micron trace/33 micron space
■High reliability
■Rad Hard

Brand of Product：	TTM Technologies
Part#：
Product Category：	More
Application：	[ aerospace applications ] More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2020/3/11
Version Number：
Data Encoding：
Data Size：	1.6 MB

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