5G Challenges for PCB fabrication
■It is important to know what our industry is trending towards and how to get ready for the manufacturing of future products.
■This eBook will cover the next generation of PCB Technology drivers, our understanding of 5G and the expected challenges that may arise in PCB fabrication. 5G products are expected to require complex attributes in PCB designs.
■The author, Joe Jiang, is the Field Application Engineering Manager of our Communications & Computing (C&C) Business Unit, supports our customers in the cellular, networking and communications, and computing end markets.
■We look forward to meeting your technology and manufacturing needs.
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Supplier and Product Introduction |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017/12/5 |
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4.3 MB |
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