RF TECHNOLOGY OVERVIEW
■Mixed Dielectrics for RF & Digital
■Buried / Blind / Microvia Interconnects
■Exposed Cavities - Multi Depth
■Sequential Lamination
■Formed PCB’s
■Ormet Interconnections
■Back Drilling – Via Stub Reduction
■Hole Fill - Low DK / Low Loss
■Metal Core & Metal Back
■Planar Resistors - Ohmega + Ticer
■Screened Ink Resistors
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2020/10/16 |
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411 KB |
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