High-Density Interconnect Technology
■HDI Printed circuit board ("PCB") have high-density attributes, including laser microvias, sequential lamination structures, fine lines, and high-performance thin materials. This increased density enables more functions per unit area. Advanced technology HDI PCBs have multiple layers of copper-filled stacked microvias, which creates a structure that allows even more complex interconnections. These complex structures provide the necessary routing and signal integrity solutions for today's large pin-count, fine pitch, and high-speed chips in high technology Standard Advanced products.
●A FAST-GROWING PCB TECHNOLOGY FOR ADVANCED APPLICATIONS HIGHER ROUTING DENSITY IN BGAS
■Increasing packaging density and decreasing component pitch, the use of micro ball grid arrays ("BGAs"), and the ongoing need to reduce the size and weight of devices is pushing the PCB technology towards creating more dense 2-Track is possible for 0.8 mm BGA; still 1-track can be routed. structures. Line width, spaces and pad sizes are minimized and the use of laser vias is necessary to meet the 1.0 MM: 3 TRACK 0.8 MM: 2 TRACK 0.5 MM: 1 TRACK designers requirements. Improved registration is implemented to realize the necessary tolerances and the imaging and etching technologies are improved for better resolution and tolerance. All these improvements are combined in the HDI Technology, while the most prominent feature is the laser drilled via.
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022/3/10 |
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601 KB |
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