Real World of RF Printed Circuit Boards
2023-12-25
■Introduction
▲Real World of RF Printed Circuit Boards
●It is not hyperbolic to say that the electronics industry would not exist without printed circuit boards (PCBs).Integrated circuits, in both the RF and digital domains, are getting increasingly dense and sophisticated, but those input and output signals still need to go somewhere and that is why we need increasingly sophisticated PCB solutions. Printed circuit boards are foundational building blocks for the electronics industry and various industry sources estimate that the printed circuit board market will surpass $140 billion in revenue in the early 2030s.
●Not only is the PCB market large, but the trend is for all the market applications segments to go higher in frequency in search of more bandwidth to support the insatiable data demand from consumers and the enterprise. Coupled with a shift to higher frequencies, electronic devices are demanding higher performance from the digital and analog circuitry. The value of electronic devices for consumer and defense applications is anticipated to be more than $2 trillion by 2030 and all these devices and this revenue will be enabled by some form of signal routing. The combination of increasing operating frequencies and the expectation of better device performance forms the basis for this eBook.
●This eBook addresses some of the challenges and best practices when designing and fabricating PCBs for RF applications. The first article gives a good overview of the fabrication process for a variety of different multilayer printed circuit boards. The second article provides insight into the reality of PCB fabrication versus the ideal models and how those differences become more important as circuits go higher in frequency. Article three acknowledges that these PCBs will operate at elevated temperatures and it provides insight into the failure mechanisms, test methods and proper selection of substrate materials to optimize temperature performance. The fourth article provides good technical details about how to select the proper circuit board dielectric material as applications go higher in frequency. The final two articles address the finer points of the board design and manufacturing process for a microwave power amplifier and a microwave/millimeter wave patch antenna.
●We hope that this eBook gives you a good overview of the possibilities that can be enabled by high performance RF PCBs and how to address the design challenges. These PCBs will be instrumental in delivering the performance required by the next generation of electronic components for all applications. The team at Rogers Corporation continues to provide innovation and breakthroughs in reliability, efficiency and performance to help power, protect and connect the world. We thank them for sponsoring this eBook so that we can offer it to our readers for free.
▲Real World of RF Printed Circuit Boards
●It is not hyperbolic to say that the electronics industry would not exist without printed circuit boards (PCBs).Integrated circuits, in both the RF and digital domains, are getting increasingly dense and sophisticated, but those input and output signals still need to go somewhere and that is why we need increasingly sophisticated PCB solutions. Printed circuit boards are foundational building blocks for the electronics industry and various industry sources estimate that the printed circuit board market will surpass $140 billion in revenue in the early 2030s.
●Not only is the PCB market large, but the trend is for all the market applications segments to go higher in frequency in search of more bandwidth to support the insatiable data demand from consumers and the enterprise. Coupled with a shift to higher frequencies, electronic devices are demanding higher performance from the digital and analog circuitry. The value of electronic devices for consumer and defense applications is anticipated to be more than $2 trillion by 2030 and all these devices and this revenue will be enabled by some form of signal routing. The combination of increasing operating frequencies and the expectation of better device performance forms the basis for this eBook.
●This eBook addresses some of the challenges and best practices when designing and fabricating PCBs for RF applications. The first article gives a good overview of the fabrication process for a variety of different multilayer printed circuit boards. The second article provides insight into the reality of PCB fabrication versus the ideal models and how those differences become more important as circuits go higher in frequency. Article three acknowledges that these PCBs will operate at elevated temperatures and it provides insight into the failure mechanisms, test methods and proper selection of substrate materials to optimize temperature performance. The fourth article provides good technical details about how to select the proper circuit board dielectric material as applications go higher in frequency. The final two articles address the finer points of the board design and manufacturing process for a microwave power amplifier and a microwave/millimeter wave patch antenna.
●We hope that this eBook gives you a good overview of the possibilities that can be enabled by high performance RF PCBs and how to address the design challenges. These PCBs will be instrumental in delivering the performance required by the next generation of electronic components for all applications. The team at Rogers Corporation continues to provide innovation and breakthroughs in reliability, efficiency and performance to help power, protect and connect the world. We thank them for sponsoring this eBook so that we can offer it to our readers for free.
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