MINIATURISATION TO THE POWER OF TWO–PART II Combine the advantages of RIGID.flex and HDI on your printed circuit board!
■Part 1
●The combination of HDI and rigid-flex makes optimal use of the advantages of both technologies.
●The technology HDI uses Micro and Buried Vias to
◆-Gain space in the layout or
◆Reduce the size of the overall system.
●The technology Rigidflex creates additional space in the system by
◆The elimination of connectors, connector footprints and Cable harnesses or
◆The three-dimensional use of the housing space.
●The Aspect Ratio plays an important role in the selection of the via pad diameter.
●The different Filling types require the observance of the applicable design rules in the Layout.
◆Min. distances copper to copper
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Supplier and Product Introduction |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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13.07.2021 |
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3.3 MB |
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