Features: Production Technology of Sanyo Denki Common to Divisions Analysis of Plated-Through Hole Reliability of Printed Wiring Boards
●Introduction
■There was a standard that via holes of printed wiring boards (hereafter called "boards") must be soldered. However, soldering these holes is time-consuming, and for boards on which surface mounted packages are soldered by the reflow process, it is practically impossible to solder the holes.
■We tested the plated-through hole reliabilities of boards having soldered via holes and boards having unsoldered via holes, and modified the standard of soldering via holes based on the test results.
■This paper explains various standards relating to the plated-through hole reliability test, describes the kinds of test boards used and how the test was conducted. The results of the reliability test and conclusions of the study are then discussed.
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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Nov. 1996 |
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160 KB |
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