High Density Multilayer Printed Wiring Board

PublishTime：2022-10-29

● For downsizing and enhancing the performance of electronic devices higher density and thinner printed wiring boards are required. Thus, we developed two-layer build-up six-layer flexible printed circuit (FPC) boards that are very thin, have soft flexible parts, and are capable of making high-density circuit. We got good results in all reliability tests such as thermal cycling test and migration test. The developed thinness of multilayer boards and high-density circuits enable us to meet demand of the market.

Brand of Product：	Fujikura
Part#：
Product Category：	High Density Multilayer Printed Wiring Board More
Application：	More
Data Type：	Supplier and Product Introduction More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
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Language：	English Chinese Chinese and English Japanese
Date of Creation：	2007/5/30
Version Number：
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Data Size：	83 KB

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Integrated Circuits