SBU PCBs
●Description: A technological solution for High-Density PCB.
●Technical
■Construction
▲Up to 32 Layers
▲Sequential multilayers
▲Base copper thickness : 5μ, 9μ, 12μ, 18μ, 35μ, 70μ, 105μ
■Dimensions
▲Maximum PCB size: 478 x 592 mm
▲Maximum thickness: 5 mm
■Base material
▲High Tg epoxy (Tg>175°C) compatible RoHS
▲Materials for high frequencies (4 to 15 Ghz)
▲Polyimide
▲ROGER 4350
▲Green material (halogen free)
■Surfaces finishing
▲Electroless Nickel/Gold (ENIG)
▲Electroplated Nickel/Gold
▲Immersion tin
▲Tin Lead reflow
▲OSP
■Line & Spacing
▲External standard : 60μ/75μ
▲Internal standard : 50μ/75μ
▲Internal advanced : 40μ/60μ
■Blind vias (mechanical)
▲Drilling diameter: 100μ
■Thru hole
▲Min drilling diameter: 150μ
▲Aspect ratio: 16:1
■Laser vias
▲Sequential multilayers (3 levels)
▲Stacked microvias
▲Via copper filling
▲Drilling diameter: 75μ
■BGA
▲Up to 1980 I/O
▲Pitch : 1, 0.8, 0.65, 0.5, 0.4, 0.3 mm
■Flip Chip
▲< 250μ pitch
■Impedance Check
▲Tolerance of impedance: ± 10%
▲Reflectometer Polar
■Tests
▲100% Automatic-Optical-Inspection
▲100% electrical test
▲Visual inspection
■Quality Controls
▲Guarantee of custom-designed quality standards and production according to international guidelines:
◆Vision 2000 - CNES - AS9100B
◆EN9100:2003/S1 - JISQ9100:2004
◆UL Certified: 94V-0 up to 130°
◆Process including reliability tests (daisy chain board)
◆State of the art Laboratory
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2011/4/7 |
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679 KB |
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