Semi-Flex Printed Circuit Technology
■FR-4 material processing parameters
■The material in ‘bend-area’ is reduced in thickness by depth controlled routing
■Suitable for flex to install (1-time bend) applications only (no dynamic flex)
■No expensive flex materials and process-flow required
■One PCB replacing two PCBs + interconnects (connectors, solder-joints)
■PCB is mechanically fixed after bending
■Flexible soldermask applied in bending area
●TTM Technologies (“TTM”) offers semi-flex circuit boards manufactured with conventional rigid FR-4 base materials. These boards are suited for one-time flex-to-install applications. The technology can be used for double-sided and multilayer boards. Because only standard materials and processing are used, this technology offers a low-cost alternative for applications with flexible or bendable areas in a printed circuit board (“PCB”). A semi-flex board most often replaces two PCBs and the required connectors and cables or allows a three-dimensional design and placement of the PCBs in a device.
●The flexible segment in a semi-flex PCB is generated by controlled depth milling of the PCB in the required area. TTM’s newest routing machines with z-Axis technology and integrated measuring and mapping functions is critical to the consistent and high-quality fabrication of semi-flex.
●The flexible area is covered with a flexible soldermask. The materials and glass style are chosen so that the bending can be done without an impact on the reliability of the circuit board.
●Reliability testing shows good results and the ability to have multiple bends without damage to the bending area. TTM recommends, in general, not more than five cycles. Details are to be defined based on the stackup.
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022/5/19 |
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4 MB |
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