Data Package Checklist
■Inner and outer layer data (all copper layers)
■Soldermask layers
■Legend layers
■Aperture list if apertures are not embedded in the Gerber data (RS-274X)
■Drill file with tool codes and X-Y coordinates of all holes in either ASCII or EIA format
■IPC 356 netlist or mentor graphics neutral file
■A readme file that contains an engineering contact and any special instructions
●Blue Print Elements
■Drawing in Gerber, HPGL, PDF, DXF format, or hardcopy
■Board outline dimensions including cutouts, chamfers, radii, bevels, scores, etc.
■Dimension from a reference hole in the board to a corner or to two sides of the board outline
■A hole chart with the hole symbols on the drawing and the finished hole sizes
■Material requirements
■Finished board thickness and tolerance
■Layer stack-up order
■Controlled impedance requirements (if applicable)
■Dimensioned array drawing if the design is to be shipped as a multiple -up array
■Notes defining any other requirements or specifications pertinent to the design
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2020/10/23 |
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197 KB |
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