EPC7019 – Rad Hard Power Transistor
●These devices have exceptionally high electron mobility and a low temperature coefficient resulting in very low R-DS(on) values. The lateral structure of the die provides for very low gate charge (Q-G) and extremely fast switching times. These features enable faster power supply switching frequencies resulting in higher power densities, higher efficiencies and more compact designs.
●EPC7019 eGaN® FETs are supplied only in passivated die form with solder bumps. Die size: 6.05 mm x 2.3 mm
■Features:
●Ultra high efficiency
●Ultra low Q-G
●Ultra small footprint
●Light weight
●Total dose
◆Rated > 1 Mrad
●Single event
◆SEE immunity for LET of 85 MeV/(mg/cm²) with V-DS up to 100% of rated breakdow
●Neutron
◆Maintains Pre-Rad specification for
up to 3 x 10¹⁵ Neutrons/cm²
[ Commercial satellite EPS ][ avionics ][ Deep space probes ][ High frequency Rad Hard DC-DC conversion ][ Rad Hard motor drives ] |
|
Datasheet |
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
May, 2022 |
|
|
|
|
|
1.3 MB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.