Thermal Model of EPC7018
■The thermal model applies to EPC7018.
■A power dissipation of 1 W in the device active area is assumed.
■Finite element analysis (FEA) thermal simulations
▲RΘJB and RΘJC are obtained by stationary simulations.
▲ZΘJB and ZΘJC are obtained by transient simulations.
■R-C thermal model is generated.
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2024/2/3 |
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1.5 MB |
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