AX7696MKS-01 R*evolution® Remote Plasma Source for Process On Wafer
■Self-contained and compact, R*evolution delivers up to 10 slm of oxygen radicals from a 6kW power supply with true power accuracy of <1% resulting in a high density, extremely clean radical source for photoresist strip and an optimal clean rate greater than 12 microns/min-1. R*evolution can be used for other surface preparation applications.
■Equipped with EtherCAT® communication protocols, R*evolution streams intelligent data sets to the tool or fab database to monitor or modify operating parameters, keeping process tools running at peak efficiency and supporting diagnostics for Automated Process Control (APC) and Fault Detection and Classification (FDC) applications.
●Product Features
■Integrated, self-contained unit designed for on-chamber installation
■High density radical species delivery
■Up to 6 kW of plasma power with accurate power reproducibility
■Advanced degree of power control of <1%
■Fast, reliable plasma ignition in process gas
■Short pulse capable in seconds
●Key Benefits
■Compact size makes on-chamber integration and installation easy
■Optimal productivity for oxygen based applications through toroidal plasma source promotes high concentrations of radicals at the wafer surface
■Excellent process repeatability unit to unit supports chamber to chamber matching
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Please see the document for details |
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04/20 |
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