Alternave materials: Alternave Bill of Materials (BOM) & Packing Method for TO Packages Product Change Notification (Final-PCN-28)
■Alternave materials for leadframe, molding compound and die aach material used in the assembly of TO packages is being qualified.
■The material changes will not impact the performance and funconality of the device.
■Qualificaon results of the alternave materials will be provided with the Final PCN
■On the product packing the quanty per inner box may change from 600 per box to 300 per box.
●Reason for Change
■Ulizaon of the standard assembly site material
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PCN/EOL |
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Please see the document for details |
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TO |
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English Chinese Chinese and English Japanese |
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10/1/2021 |
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Final-PCN-28 |
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279 KB |
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