High Frequency RF Spiral Inductor for Wire Bonded Assemblies
●PSC series RF spiral inductors are designed for RF circuits that require wire bondable components.High precision equivalent circuit modeling enables accurate computer simulation of component performance.Additional values and form factors available upon request.
●FEATURES
■Wire bond assembly
■Small size:45 mils x 45 mils x 10 mils
■Low DCR,high Q
■Low parasitic capacitance,high SRF
●APPLICATIONS
■RF choking for DC biasing
■RF tuning circuits
■Lumped element filters
|
|
Datasheet |
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
13-Mar-17 |
|
Revision: 13-Mar-17 |
|
61050 |
|
247 KB |
- +1 Like
- Add to Favorites
Recommend
- Firstohm‘s Superior Anti-Surge Wire Wound Axial Resistor SSWA Series With a low-temperature coefficient and a wide temperature range
- GT23SC4442 256 Byte EEPROM with Write Protect Function and Programmable Security
- 1024 x 8 Bits of EEPROM with Write Protect Function and Programmable Security Code
- EPC Launches 2kW, 48 V/12 V DC-DC converter for More Efficient, Smaller, Faster, Bidirectional Converters for Mild-Hybrid Cars
- TT Electronics EBW5216 Busbar Shunt Resistors for High Current Measurements in The Hundreds of Amps Range
- How To Use An EPC Development Board to Evaluate The Performance of A Given GaN FET or IC in Common Applications?
- How to Design a 2 kW 48 V/12 V Bi-Directional Power Module with packaged eGaN® FETs
- 蓝牙SOC芯片是无线通信技术的核心力量
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.