ATP e.MMC v5.1 Embedded Flash Storage Solution
Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package). The tiny footprint makes it perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments.
ATP e.MMC is built to meet the tough demands of industrial applications. As a soldered-down solution, it is secure against constant vibrations. Its industrial temperature rating means that severe scenarios from freezing cold -40°C to blistering hot 85°C will not cause adverse impact on the device or the data in it.
Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC features Command Queuing and Cache Barrier to enhance random read/write performance; High Speed 400 (HS400) DDR Mode for a bandwidth of up to 400 MB/s; and field firmware update (FFU). Cache Flushing Report ensures the data integrity on cache blocks; Enhanced Strobe in HS400 Mode facilitates faster synchronization between the host and the e.MMC device; and, Secure Write Protection ensures that only trusted entities can protect or unprotect the e.MMC device.
It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, high priority interrupt (HPI), and hardware (HW) reset.
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[ Surveillance ][ IoT Gateways / 5G Small Cell ][ Automation ][ Test and Measurement ][ Embedded PCs ][ Medical ][ Drones ][ Transportation ][ Networking ][ Mobile/Handheld Computers ] |
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Datasheet |
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RoHS |
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Please see the document for details |
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Industrial |
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FBGA |
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English Chinese Chinese and English Japanese |
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19/03 |
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1.8 MB |
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