HCSEL Core Technology “Chip-level“ Line Laser Projection Module Made A Heavy Appearance

PublishTime： 2023-06-10 Article Source：LEMON Photonics News

In recent years, with the development of 3D perception technology and the market, companies involved in the VCSEL field have gradually increased, among which Chinese companies are indispensable to the figure of LEMON Photonics is a "new star" that cannot be ignored in the high-end semiconductor laser chip segment. Since its establishment in 2018, LEMON Photonics has successfully developed a number of world-leading semiconductor laser chip products, as well as optical module and light engine solutions based on independent chip products.

LEMON Photonics product line involves three product lines: vertical cavity surface emitting laser (VCSEL), horizontal cavity surface emitting laser (HCSEL), and edge emitting laser (EEL), mainly targeting 3D sensing, consumer electronics, AR/VR, robotics, lidar, intelligent manufacturing, Internet of Things, data center and medical beauty. At the same time, LEMON Photonics is also developing special optical application solutions for semiconductor lasers to improve the application quality of lasers and drive the laser application market.

Insight into customer needs, continuous iterative innovation of products

At present, the HCSEL laser chip independently developed by Lemon Photonics has special advantages in applications such as lidar and industrial processing. HCSEL laser chip is compatible with the advantages of EEL high power output and VCSEL is more suitable for large-scale mass production, can meet multiple applications at the same time, and has a wider range of applications for laser light sources with higher peak power, smaller spectral temperature drift, and longer laser bands, and the products have been widely trusted and recognized by customers. This has allowed many key industries such as industry, machine vision, and automotive lidar to see the huge potential of lemon photonics in the market. Therefore, Lemon Photonics continues to develop innovative technologies, iterate new products, gain insight into customer needs, and accurately develop market pain points with exclusive innovative patented HCSEL "chip-level" line laser projection modules to empower laser light source solutions.

Exclusive innovation patent: HCSEL "chip-level" line laser projection module

Technology upgrading is the driving force behind product innovation. Based on the exclusive and innovative horizontal cavity surface emitting laser (HCSEL) technology, Lemon Photonics has developed and customized the high-performance HCSEL "chip-scale line laser projection module" according to the radar system perception principle. The main core components of the product are semiconductor laser chips, light field management devices, and ceramic packaging, all of which adopt semiconductor processing or automated packaging and other highly specialized processes, suitable for mass production, which is conducive to improving the efficiency of lidar systems and widely penetrating the market.

High reliability to meet market demand

At the same time, Lemon Photonics conforms to market development and customer needs, and HCSEL's "chip-scale" line laser projection module can provide an ideal collimation ultra-narrow linewidth line light source, which greatly improves the signal-to-noise ratio of radar systems.

It is worth mentioning that this product is an exclusive innovative product of LEMON Photonics, and there are no similar chip and module products on the market. The existing line laser module applied to lidar is basically based on edge-emitting laser technology, the chip packaging form is complex, and optical shaping requires multiple lenses, large volume, and high price. Therefore, lemon photonics products have outstanding advantages, solve the pain points of the industry, build core competitiveness with technology research and development, and promote the high-quality development of the industry.

The HCSEL chip technology on which this product is based has advantages over other laser chips

* Ultra-high power can achieve hundreds of watts of peak power in a single tube

*Special design gives the chip higher reliability

* Optical design is convenient for 3D sensing and LiDAR applications to effectively filter out noise

*Excellent beam quality reduces the difficulty of optical shaping and improves the utilization rate of the light field

*Excellent light management is conducive to sensing detection and optical beam combination

The simple chip manufacturing process theoretically guarantees a more controllable cost

LEMON Photonics HCSEL line laser projection module takes the superior HCSEL laser technology as its core competitiveness, and will completely change the light source solutions and market pattern of application markets such as lidar, machine vision, and industrial processing. It provides a more innovative and more possible localized chip solution for the current lidar market. In the future, LEMON Photonics will, as always, dig deep into customer pain points, continuously improve its independent innovation capabilities, and achieve breakthroughs in key core technologies. Continue to contribute to domestic autonomy and high-end in the field of lidar.

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