LEMON Photonics 808nm and 850nm VCSEL Chips Feature High Efficiency, High Reliability, and Excellent High-temperature Performance

2023-06-10 LEMON Photonics News
VCSEL chip,near-infrared VCSEL chip

It is reported that LEMON Photonics, a high-end semiconductor laser chip design manufacturer, recently launched the industry-leading high-performance high-power 808nm and 850nm VCSEL series products. Following the launch of the 940nm VCSEL series products last year, the company has further complemented its wide-power-range, near-infrared VCSEL chip series products catalog. The new series of VCSELs features high efficiency, high reliability, and excellent high-temperature performance. They can be widely used in infrared lighting and other fields such as three-dimensional sensing, Lidar, laser pumping, security, and medical treatment.


In recent years, with deeper insights and expanded application demands of VCSELs, they have entered the consumer electronics market as the infrared light source for 3D sensing applications, becoming necessary components for face recognition, gesture recognition, 3D recognition, iris recognition, ADAS (advanced driver-assistance systems) and VR/AR applications. With the continuous advancement of 5G infrastructure construction, it is foreseeable that VCSELs’ future applications and market heat would be even more prominent

Light Counting, a market research institute has predicted that the global demand for VCSEL on smartphones would be 120 million counts in 2018, and would reach 240 million in 2019.  According to "VCSELS - Technology, Industry, and Market Trends", a report released by Yole Development, the overall market size of VCSELs reached $330 million in 2017, and VCSEL shipments are expected to increase from 652 million in 2017 to more than 3.3 billion by 2023. By that time, the overall market size will reach $3.5 billion, and the compound annual growth rate from 2017 to 2023 will reach up to 48%

the new 808 nm and 850 nm VCSELs from LEMON Photonics have the following characteristics


1. Wide range of specs: the output power ranges from a few milliwatts, hundreds of milliwatts, general-purpose 1W, 2W, to high-power 4-10W (continuous output) or higher (pulse output)

2. Realized industry-leading electro-optic conversion efficiency in continuous output (CW) mode, PCE ~ 48% (1W chips), PCE ~ 46% (8W chips);



3. Maintaining high performance at high temperatures, the electro-optic conversion efficiency of the 850 nm VCSELs exceeds 25% when working at a heat sink temperature of 120℃;



4. Multiple designs are used to achieve different beam divergence in order to meet the various needs of customers.

Further improvement of VCSEL chip performance requires careful manipulations of every single link in design and processing. This is not only reflected in the specific design of key features such as quantum well active region, reflective mirrors (DBR), oxide layers, etc. but also in the overall consideration for different applications and the optimization of the rear-end processes.


With the upgrading of consumption structure and manufacturing industries, consumer electronics, automotive Lidar, and industrial machine vision products have increasingly higher performance requirements for laser 3D sensing, high-temperature operational efficiency, and stability of VCSELs are among the most important indices. This series of VCSELs benefits from the optimized overall design, and has shown industry-leading high-temperature performance during clients’ comparative tests.


This series of VCSELs from LEMON Photonics is ready for mass production. They use 6-inch epitaxy and tape-out process, have extremely streamlined fabrication procedures, and have been verified in many mature 6-inch wafer foundries at home and abroad. At the same time, the products have excellent reliability and have passed the accelerated aging test of continuous light output for more than 2000h at a heat sink temperature of 50℃.


In addition to providing standardized VCSEL products with different output powers, Lemon Photonics could also provide customized design services of chips and corresponding modules tailored to customers’ needs, such as customized conventional VCSELs with beam divergence between 20 and 30 degrees, and high energy density VCSELs for dToF applications which is currently under development

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