Smiths Interconnect Participated in SEMICON Taiwan September 4-6, 2024

PublishTime： 2024-09-10 Article Source：Smiths Interconnect Official Website

Smiths Interconnect was pleased to announce its participation in SEMICON Taiwan 2024, which took place from September 4-6 in Taipei under the theme "Breaking Limits: Powering the AI Era." The event was expected to be the largest yet, featuring over 1,100 companies across 3,700 booths.

SEMICON Taiwan 2024 spotlighted key topics such as advanced processes, compound semiconductors, silicon photonics, and smart mobility, showcasing the semiconductor industry's critical role in supporting the AI revolution.

The evolution of AI chips, with their increasing computational power, was driving a demand for more integrated transistors, resulting in chips with areas up to 878 mm² and approximately 25,000 pins. These specifications presented significant challenges in developing robust testing solutions, necessitating exceptional hardware design and high stability in complex scenarios.

Amid this backdrop, Smiths Interconnect, a leader in the semiconductor testing industry, showcased a range of flagship testing products and AI testing solutions at SEMICON Taiwan 2024. They invited both new and existing customers to visit them at Hall 1 Booth 3190 and explore their innovative offerings.

DaVinci 56 – High Speed Test Socket

·High performance impedance-controlled socket

·Proprietary insulated metal socket

·Spring probe technology

·Entire signal path shielded

·Insensitive to temperature changes and humidity

·Extreme rigidity (very low deflection rate)

·Mixed impedance in same Array

·Low contact resistance

·High current carrying capacity

·High speed: 56 to 112 Gbps

DaVinci 112

·Solution for BGA, LGA and other variants

·Spring probe technology using homogenous alloy gold plated

·RF Bandwidth > 40Ghz @ -1dB IL

·Short signal path 4.90 mm test height

·43, 50 Ohm impedance (single-ended)

·Consistent stable contact resistance 80 mΩ (Ave)

·Hi-Coplanarity accommodation

·Tri-Temp socket design to support -55℃ to +125℃

·Designed for manual test, bench test, and HVM production test using the same socket

Spring probe technology using homogenous alloy

·Short signal path 2.85 mm Test Height

·Impedance tuning, can match system or defined as needed, 40, 45, 50 Ohm impedance (single ended)

·Cross-talk suppression IM housing

·Tri-temp socket design to support -40℃ to +125℃

·Consistent stable contact resistance 120 mΩ (Ave)

·Designed for manual test, bench test, and HVM Production Test using the same socket

·Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm

·Floating base or Hi Low configuration to protect spring probes during use

Levan Elastomeric Contact Test Socket

·Solution for BGA, LGA, QFN and other variants

·RF Bandwidth > 23-108GHz @ -1dB IL

·Short signal path ≤ 0.9 mm

·Ability to do Impedance match signals

·Consistent stable contact resistance

·Low Inductance

·Optimized design based on test application

·Tri-Temp socket design to support -55℃ to +160℃

·Designed for manual test, bench test, and HVM production test using the same socket

In 2024, with the recovery of demand in the consumer electronics market and customer inventory reduction, coupled with the increasing testing demand for new AI-driven models with large packages, high pin counts, and high-power consumption GPUs, CPUs, HPCs, and AI products, we believe Smith Interconnect will see even greater opportunities in the semiconductor testing market.

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