Smiths Interconnect‘s DaVinci 112 Test Socket Shortlisted for 2024 World Electronics Achievement Awards
Smiths Interconnect is proud to announce that its DaVinci 112 test socket has been shortlisted as one of the top Test & Measurement products for the 2024 World Electronics Achievement Awards, hosted by AspenCore.
The World Electronics Achievement Awards recognize companies and individuals who have made exceptional contributions to innovation and the development of the global electronics industry. Being shortlisted for this prestigious award is a testament to Smiths Interconnect's commitment to advancing technology and delivering cutting-edge solutions.
Recommended Reasons
Smiths Interconnect announced the expansion of its DaVinci Series to incorporate DaVinci 112 - ideal for testing the most complex functionality of Application Specific Integrated Circuits (‘ASICs’). With DaVinci 112, Smiths Interconnect has achieved full coverage of the product line for high-speed test of 0.35mm pitch and above. Historically Cloud, Data centers, Artificial Intelligence, and Connected Automotive segments have all used CPUs or GPUs that were intended for other applications. As the performance, functionality and size of the chips for these end-use applications continue to increase, now companies are designing and manufacturing Application Specific Integrated Circuits intended solely for the end segment.
Addressing high-speed signaling, device complexity, and power requirements, the pin count is well over 4000 I/O’s all working in tandem to meet the specification. At the same time, testing these devices in full functionality is difficult due to noise isolation. DaVinci 112 test socket change in mechanical structure ensures the ground probe is always in contact with the socket body. This improved ground path offers a cleaner power delivery and is a significant feature to isolate pin-to-pin cross-talk, with 50% improvement of the cross-talk isolation over the DaVinci 56 test socket. DaVinci 112 test socket increases production yields and throughput, eliminating false faults and complete functional failures. As a result, it has significantly improved our client’s chip test yields and overall test throughput while saving test costs.
- +1 Like
- Add to Favorites
Recommend
- Smiths Interconnect Introducing the Next Generation of High-speed Test Solutions ——DaVinci 112
- Smiths Interconnect DaVinci 112 Test Socket: A Game-Changer in High-Speed Chip Testing
- Smiths Interconnect expands DaVinci test socket offering which is designed for high-speed testing of 0.35mm minimum pitches
- Smiths Interconnect Announced DaVinci 56 Test Socket for Reliable Testing up to 67GHz Analog RF / 56Gbps NRZ Digital
- Smiths Interconnect Participated in SEMICON Taiwan September 4-6, 2024
- Smiths Interconnect Acquires Reflex Photonics to Expand in High Speed Data Transmission Market
- How Smiths Interconnect Keeps The Medical World Connected
- Smiths Interconnect Expands into Burn-In Test Market with Acquisition of Plastronics
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
