Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards
Shenzhen, November 5, 2024 – Smiths Interconnect is thrilled to announce that its DaVinci 112 high-speed test socket received the prestigious Best Test Measurement Award of the Year at the Global Electronics Achievement Awards (GEAA) ceremony held at the Four Seasons Hotel in Shenzhen. This annual event honors industry leaders and companies making significant contributions to global electronics innovation.
Organized by ASPENCORE, the Global Electronics Achievement Awards recognizes the industry's elite, including companies, managers, and products that have demonstrated exceptional performance and leadership. The award review committee, comprising senior ASPENCORE industry analysts and user groups from Asia, the United States, and Europe, selected the DaVinci 112 test socket for its outstanding commercial performance and technical innovation.
Representing Smiths Interconnect at the ceremony were Frank Zhou, Global R&D Director, and Eason Xu, Sales Director of China Semiconductor Testing Division. Together with industry peers, they celebrated the achievements of the year and the bright future of semiconductor technology.
Smith Interconnect Global R&D Director Frank Zhou came to the stage to receive the award
The DaVinci 112 high-speed test socket is engineered to meet the rigorous demands of chip testing. It supports large-size chips up to 130x130mm with more than 30,000 input/outputs and a coplanarity tolerance of up to 0.65mm, effectively preventing connection issues due to poor coplanarity and ensuring superior signal integrity.
Smiths Interconnect’s R&D team developed an innovative mechanical structure to prevent socket warping, a common challenge in high pin-count and high-power testing applications. This design enhancement guarantees reliable ground contact, delivering improved power transmission and signal isolation. Additionally, the DaVinci 112’s use of advanced IM conductive materials offers robust mechanical stability, making it an ideal choice for high-speed, high-power chip testing in sectors such as high-performance computing, data centers, and mobile devices.
Frank Zhou, Global R&D Director of Smiths Interconnect Semiconductor Test Division, shared his pride in the DaVinci 112’s recognition, stating, “We are honored by the positive feedback from both customers and the market. Smiths Interconnect remains committed to pushing the boundaries of technology, embracing innovation, and prioritizing customer needs as we look forward to introducing the next game-changing products in our DaVinci series.”
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