Smiths Interconnect expands DaVinci test socket offering which is designed for high-speed testing of 0.35mm minimum pitches
Smiths Interconnect announces the expansion of its DaVinci product line to incorporate the DaVinci Micro test socket, designed for high-speed testing of 0.35mm minimum pitches.
DaVinci Micro
The rapid expansion of connected devices and data-intensive applications is driving the growing demand for highly efficient and adaptive high-performance computing solutions. Mobile devices such as cell phones, tablets, and car infotainment systems have the most sophisticated System-on-Chip (SoCs) ever produced. In fact, these SoCs must combine CPU, GPU, AI engine, camera processor, memory, and 5G modem in the smallest possible form factor.
The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing. Despite great efforts to improve packet design, the reduction in size inevitably leaves critical high-speed signal lines susceptible to crosstalk, causing false failures during testing.
It is the field of test engineering that Smiths Interconnect aims to break through with DaVinci Technology. DaVinci Micro test socket leverages the DaVinci coaxial technology for integrated circuit applications to 350µm pitch to provide ideal pin-to-pin isolation, negating the effect of cross-talk during a test and substantially improving the accuracy of chip performance testing. Its innovative design protects the small diameter signal probes and ensures that the product can be deployed and withstand the rigors of a production test environment.
"The addition of DaVinci Micro high-speed test socket will enable Smiths Interconnect to offer a solution that can significantly accelerate our customers' innovation in high-performance computing, graphics, and adaptive SoCs technologies," said Brian Mitchell, Vice President and General Manager of the Semiconductor Test Business Unit at Smiths Interconnect. "The fully shielded signal path of DaVinci Micro, which eliminates the negative effects of cross-talk during testing, allows for an immediate performance improvement that distinguishes it from non-DaVinci products."
- +1 Like
- Add to Favorites
Recommend
- Smiths Interconnect Introducing the Next Generation of High-speed Test Solutions ——DaVinci 112
- Smiths Interconnect Announced DaVinci 56 Test Socket for Reliable Testing up to 67GHz Analog RF / 56Gbps NRZ Digital
- Smiths Interconnect Acquires Reflex Photonics to Expand in High Speed Data Transmission Market
- How Smiths Interconnect Keeps The Medical World Connected
- Smiths Interconnect Expands into Burn-In Test Market with Acquisition of Plastronics
- Smiths Interconnect Expanded RF Filter Capability for European and Asian Markets
- Smiths Interconnect NXS Series, New Ultra-High Density, Space Qualified Interconnect
- Smiths Interconnect’s cPCI launched on NASA Mars Perseverance Rover – Interconnect Product of the Year
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
