What Should Be Noted When Testing Board-to-Board Power Connectors?
Board-to-Board Power Connectors are now increasingly focused on small pitch and precision manufacturing. The flexibility, transmission performance, miniaturization, and thinness of board-to-board connectors can well adapt to the development changes of intelligent devices, while maintaining a firm connection, they can also minimize the space occupied by the products. In the production and manufacturing of high-quality and high-performance board-to-board power connectors, the testing of double-slot/single-slot board-to-board connectors is essential.
The following points should be noted in testing board-to-board power connectors:
Board-to-board power connectors generate a certain amount of heat at the contact point when they work, which will cause temperature rise. Therefore, the working temperature of board-to-board connectors should be controlled within the sum of the ambient temperature and the contact temperature rise.
Board-to-board power connectors that have been invaded by moisture and dampness will affect the insulation performance of board-to-board connectors, and metal parts will also be corroded by it. Specific test conditions are required during the testing of board-to-board power connectors: relative humidity of 90% to 95%, and temperature of 40±20℃.
When board-to-board power connectors work in an environment containing salt spray, the contact surface and metal structural parts of the board-to-board connectors may be affected by electrochemical corrosion. This will easily affect the electrical performance of the board-to-board connectors and make them unable to function properly.
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