P-SMP The High Power Board-to-Board Interconnection
■The High Power Board-to-Board Interconnection that also empowers 5G networks:
●The P-SMP interconnection from IMS CS provides an excellent continuous power handling up to 200 W. The Board-to-Board interconnection is built as a three components concept:Two PCB or panel types, assembled with an adapter, the so-called bullet. With a strong focus on robustness this connector solution provides a high reliability, by featuring a similar size like standard SMA connectors. Individual PCB board distances can be offered. Excellent RF capabilities make P-SMP connectors ideal for applications up to 10 GHz such as 5G network and power amplifier in base stations.
■Product Characteristics:
●Frequency range: DC – 10 GHz
●Body material: Brass
●Return loss: ≥32 dB @ DC to 3 GHz;≥26 dB @ 3 GHz to 6 GHz
●Outer/Centre Contact material:Copper Berylium
●Power handling: up to 200 W @ 2.2 GHz
●Contact Finish: 3-5 Ag + CuZnSn alloy
●Temperature ratings: -65°C to 165°C
●Impedance: 50 Ohm
●RoHS (2002/95/EC) conform
Selection catalogue
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P-SMP 、 7366.PSMP 、 5022.PSMP 、 7601.PSMP 、 7518.PSMP 、 7295.PSMP 、 7534.PSMP |
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[ 5G network ][ base stations ][ radios ][ filters ][ wireless ][ handheld radios ][ amplifiers ] |
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Selection guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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202109 |
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Rev. 202109EN |
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1.6 MB |
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