P-SMP High Power Board-to-Board Interconnection
■Excellent RF transmission up to 200 W
■Permits high axial and radial misalignment
■High reliability through robust design
■This newly developed P-SMP interconnection provides an excellent continuous power handling up to 200 W at 2,2 GHz. A compact design, containing of two pcb connectors and one bullet allows an optimized compensation of axial and radial misalignment by featuring a similar size to standard SMA connectors. With a strong focus on robustness this connector solution provides a high reliability. Excellent RF capabilities make P-SMP connectors ideal for applications up to 10 GHz.
●Product features:
■High RF power transmission between two boards or one board and cables transition
■Permits axial misalignment of: max. ±1 mm
■Permits radial misalignment of: max. 4°
■Enables minimum board to board distances of 12.6 mm
■Robust mechanical design
[ power amplifiers ][ base stations ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2013/10/7 |
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1 MB |
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