Waermtimo Silicone Grease with Good Thermal and Insulating Properties Is Ideal for Computer CPU Cooling
The core of a computer is undoubtedly the CPU. Its powerful and complex logic computing functions provide us with a wealth of office and entertainment projects. At present, the increasingly mainstream Core i7 processor has far superior processing power and response speed. It generates high heat during operation. The TDP (Thermal Design Power) of the i7-900 series processor is 130W. If the heat dissipation work is not done, the computer will become slower or even crash.
Whether it's a processor or a heatsink, their surface is not as smooth as the naked eye sees, and the grooves and protrusions make their surfaces not perfectly fit together, so between these gaps, there is air. Air is a poor conductor of heat, and a large amount of heat cannot be conducted, which affects the performance of the CPU.
Solution:
thermal grease is a composite of a metal oxide having good thermal and insulating properties and an organosiloxane. It has excellent thermal properties and a wide operating temperature (operating temperature -60℃ to 300℃) and is in the form of a paste. It can fill the gap between the processor and the heat sink to make the heat transfer smoother and faster.
Recommended model：
This series of silicone greases adds high-performance nano-thermally conductive fillers, making the product ideal for filling the gap between the heat sink and the heat-generating device.
It has high thermal properties and good operability.
Applicable to: CPU communication/ GPU communication, network equipment and microelectronics; notebooks, desktop computers, industrial computers, and servers.
Waermtimo:WT5932-30P
This series of silicone grease is a special formula designed for high thermal properties between metal heat sinks and heaters. This thermal grease with low construction resistance.
Advantages: low thermal resistance, high thermal conductivity; no solvent, no flow; smooth application; suitable for manual and fully automatic printing of metal interfaces.
Applicable to: CPU communication/ GPU communication, network equipment and microelectronics; notebooks, desktop computers, industrial computers, and servers.
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