Waermtimo WT5902 and WT5921 Series High Thermal Conductive Materials Suitable for VR Glasses Heat Conduction
Virtual Reality glasses(VR glasses), or VR headsets, are a new means of human-computer interaction created with the help of computers and the latest sensor technology. VR glasses are a cross-generation product that provides users with an immersive experience in a virtual environment. As panoramic content, content can be raised to a level, and VR will collaborate across fields to promote the development of other industries, such as games, social media, education, and many other industries that have produced qualitative changes.

With the development of VR technology, devices that were originally only concept products have now brought virtual experiences and fun to many gamers.
Take VR glasses from a well-known manufacturer as an example, let's explore their true colors together.

As somatosensory devices, there are of course accelerometers, gyroscopes, and laser positioning sensors. For 360° device tracking, it also has a dedicated Lighthouse infrared receiver.
It has 32 sensors in common. These photodiodes absorb infrared light from the Lighthouse base station and blink and sweep constantly, allowing the PC to calculate the precise position and orientation of the headset in the room.

Each small blue dot is an infrared filter. These filters provide photoelectric diodes with a window into which Lighthouse base stations can exchange information.

The main board that everyone cares about is full of important components:

Red—— STMicroelectronics 32F072R8 ARM Cortex-M0 microcontroller
Orange—— Toshiba TC358870XBG 4K HDMI to MIPI Dual DSI Converter
Yellow—— SMSC USB5537B Seven-port USB central controller
Green —— Kunpeng Technology AIT8328 system-on-chip (with image signal processor)
Light blue—— Xunxun CM108B USB audio decoder
Blue—— Magnesium M25P40 Serial Flash Memory (4Mb)
Purple —— Magnesium N25Q032A13ESE40E Serial Flash Memory (32Mb)
So many important components are densely distributed on the motherboard. How can the heat generated during operation be conducted and evacuated? Which high thermal conductive materials are suitable for VR glasses?
Solution 1
WT5902 series thermal pad
Recommended models: WT5902-D40-40, WT5902-D45-40
Thermal conductivity range: 4W, 5W, 6W, 7W, 8W

WT5902 series thermal pads can solve the problem of product structure design tolerance changes and can be reused. It is a good vertical heat transfer material between the heat source (CPU or electronic chipset) and the heat sink. Has good insulation and mechanical properties, can tightly integrate irregular or complex surfaces, is easy to use, and is easy to remove. It is widely used in power supply equipment, automotive electronics, communication equipment, network terminals, storage devices, consumer electronics, and other fields.
Solution 2
WT5921 series thermal gel
Recommended models: WT5921-30, WT5921-35
Thermal conductivity range: 3W, 3.5W

Thermal gel is generally packaged with a syringe. This material itself does not contain solvents. It has the characteristics of high thermal conductivity, low compression force, high compression ratio, good electrical insulation properties, and good temperature resistance. Good weather resistance, high and low-temperature resistance, good insulation properties, etc. At the same time, it has strong plasticity, can meet the filling of uneven interfaces, and meets the heat transfer requirements of various applications. It is currently the most advanced thermally conductive material.
Waermtimo WT5921 series thermal gel is a silicon resin as the base material, added with a certain proportion of thermal conductive fillers configured, and processed through a special process of mud, also known in the industry as thermal conductive clay. It has excellent high and low-temperature resistance, excellent weather resistance, radiation resistance superior dielectric properties, and anti-aging properties, which can allow VR glasses to play excellent performance.
- +1 Like
- Add to Favorites
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Recommend
Waermtimo High-Strength Thermal Pads Help PCB Conduct Heat Effectively
2023-08-23 - Device Selection Article PCB boards are widely used in electronic equipment. Generally, a soft thermal conductive silicon pad is required to improve the heat dissipation and heat dissipation effect on the component interface. Recommended thermal pad models from Waermtimo are WT5912 and WT5902 series.
Waermtimo WT5912 and WT5902 Series Thermal Pads Tightly Integrate Irregular or Complex Surfaces, Suitable for Wireless Routers
2023-08-24 - Device Selection Article For a router, placing a thermal pad between the IC‘s main chip and the heat sink, avoids noises and enhances the heat dissipation effect. Excellent thermal pads from Waermtimo suitable for wireless routers include WT5912 and WT5902 series.
Waermtimo WT5921 Series Thermal Gel with High Thermal Property Is Suitable for Compact Component Layouts like Drones
2023-12-01 - Device Selection Article In heat sink applications of drones and other electronic products, the thermal gel is superior to the thermal pad in practical operation and it enables the equipment‘s automatic dispensing, which is more compatible with today‘s high-tech production lines.
创新EMC及热界面材料制造商 产品手册 (EMI/EMC AND THERMAL INTERFACE MATERIALS MANUFACTURER PRODUCT MANUAL)
公司介绍 Company Profile 热界面材料介绍 Thermal Interface Material Introduction 导热硅胶垫片 Thermal Pad 各向异性导热垫片 Anisotropic Thermal Pad 导热凝胶 Thermal Gel 导电泡棉 FOF Gasket 石墨泡棉 Graphite Foam 半包型导电泡棉 Half-wrapped Gasket SMT导电泡棉 SMT Gasket 全方位导电泡棉 XYZ Conductive Foam 导电PE Conductive PE 导电毛丝 Conductive FOA 导电布胶带 Conductive Fabric Tape 铜/铝箔胶带 Copper/Atuminum Foil Tape 吸波材料 Wave-absorbing Material 导热吸波材料 Thermal Conductive Absorbing Material
2022/2/28 - Selection guide SINGLE-COMPONENT THERMAL GEL,SMT导电泡棉,WAVE-ABSORBING MATERIAL,导热硅胶,THERMAL INTERFACE MATERIAL,导热硅胶垫片,铝箔胶带,导电布,导电毛丝,FOF垫圈,SHIELDING MATERIAL,ANISOTROPIC THERMAL PAD,导热吸收材料,导电泡棉,吸波材料,铜/铝箔胶带,全方位导电泡棉,WAVE ABSORBING MATERIAL,铜箔胶带,各向异性热垫,FOF GASKET,导电织物胶带,热界面材料,导电布胶带,半包垫片,COPPER FOIL TAPE,导热吸波材料,导热垫片,CONDUCTIVE PE,COPPER/ALUMINUM FOIL TAPE,THERMAL GEL,半包型导电泡棉,单组分热凝胶,双组份导热凝胶,XYZ CONDUCTIVE FOAM,双组分热凝胶,石墨泡棉,GRAPHITE FOAM,导热垫,导电FOA,TWO-COMPONENT THERMAL GEL,THERMAL CONDUCTIVE ABSORBING MATERIAL,网通应用高导热材料,CONDUCTIVE FABRIC TAPE,XYZ导电泡沫,CONDUCTIVE FOA,热凝胶,HALF-WRAPPED GASKET,导电聚乙烯,各向导性导热垫片,ALUMINUM FOIL TAPE,石墨泡沫,各向异性导热垫片,屏蔽材料,SMT GASKET,导电PE,COPPER/ATUMINUM FOIL TAPE,导热凝胶,单组份导热凝胶,SMT垫片,THERMAL PAD,H800-LY,HFS-15,HFS-18,H100,HFC-MC,H300,HFC-SMT,H500,H700,H350-SOFT,H100RS,H300-RB,HTG-150DK,HFC-MC系列,HTG-150D,HFC-GB系列,SMFB系列,H200RS,HFC-MFZ系列,HFC-AM,H1200,H250,HFC-GR系列,HTG-1000,HTG-100DK,H1000,HFS-20,H1000-SOFT,H150RS,HFC-A18000,SMFB,H250RS,HTG-600,HTG-500SF,HTG-800,SMFA,HTG-200,HFC-AM系列,HFC-MF,H300MAS,HFC-MT,SMT,H500-RB,HTG-200D,HFC-A系列,HFC-A25000,H150A15,H500-LY,HTG-800D,H100A15,HFS-30,HFC-AM5000,H200,H400,H600,H200-SOFT,H800,H300-SOFT,H100-SOFT,HFC-MF系列,HFC-AM1000,H200MAS,HFC-A5000,SMFA系列,H300-HC,HTG-300SF,HFC-MFZ,H150,HFC-GR,HTDG-250,H150-LY,H700-SOFT,H600-LY,H300-LY,HFC-A,H300-HR,H300-DR,SMT系列,HTG-300,HFC-GB,H200-LD,HTG-500,H150-LD
Thermal Interface Materials For Electronics Cooling Products & Custom Solutions Catalog
Company Profile Heat Transfer Fundamentals Thermal Gels Gap Filler Pads Phase Change Materials Thermal Tapes Potting and Underfill Materials Dielectric Pads Heat Spreaders Thermal Greases Glossary
January 2022 - Selection guide THERMALLY CONDUCTIVE PADS,NON-SILICONE,PHASE-CHANGE THERMAL INTERFACE PADS,热间隙填充垫,HEAT SPREADERS,热绝缘体,间隙填充垫,DOUBLE-SIDED THERMAL TAPES,热敏胶带,热润滑脂,压敏黏合剂,THERMAL INTERFACE MATERIALS,THIN HEAT SPREADERS,DOUBLE-SIDED THERMAL INTERFACE TAPES,PRESSURE SENSITIVE ADHESIVE,THERMAL TAPES,PSA,GELS,THERMAL GAP FILLER PADS,HEAT SPREADERS,THERMAL INTERFACE MATERIALS,THERMAL INSULATOR PADS,THERMAL INSULATORS,散热器,导热垫,GAP FILLER PADS,THERMAL GREASES,导热电绝缘垫,PADS,UNDERFILL MATERIALS,THERMALLY CONDUCTIVE GAP FILLER PADS,PHASE CHANGE MATERIALS,灌封材料,THERMALLY CONDUCTIVE ATTACHMENT TAPES,THERMAL GREASES,底部填充材料,THERMALLY CONDUCTIVE ELECTRICAL INSULATOR PADS,热凝胶,导热间隙填充垫,导热连接带,绝缘垫,POTTING MATERIALS,非硅胶,相变热界面垫,THERMAL GAP FILLERS,GAP FILLERS,NON-SILICONE, PHASE-CHANGE THERMAL INTERFACE PADS,SILICONE GREASE,导热凝胶,DIELECTRIC PADS,相变材料,THERMALLY CONDUCTIVE GELS,THERMAL GELS,PAD30G,60-XX-D065-ZZZZ,60-XX-4353-ZZZZ,60-XX-D379-ZZZZ,60-XX-D417-ZZZZ,G570,PAD30A,GEL 75,T500,60-XX-6875-ZZZZ,60-XX-D420-ZZZZ,G974,60-XX-D381-ZZZZ,60-XX-4305-ZZZZ,60-XX-D382-ZZZZ,G579,579PN,A580,60-XX-D396-ZZZZ,T630,60-XX-4997-ZZZZ,60-XX-4306-ZZZZ,PAD 30,60-XX-D416-ZZZZ,6W-XX-YYYY-ZZZZ,60-XX-4996-ZZZZ,60-XX-D421-ZZZZ,60-XX-D402-ZZZZ,60-XX-6956-ZZZZ,60-XX-D404-ZZZZ,G569,60-XX-D415-ZZZZ,60-XX-D418-ZZZZ,60-XX-D429-ZZZZ,65-00-T670-3790,65-1P-CIP35-5600,60-XX-D395-ZZZZ,60-XX-D398-ZZZZ,60-XX-5792-ZZZZ,69-1X-YYYYY-ZZZZZZ,65-00-CIP35-0400,60-XX-D406-ZZZZ,T404,T647,60-12-20264-TW10,PAD60A,T405,T646,60-XX-D400-ZZZZ,T766,T644,T642,60-XX-4511-ZZZZ,60-XX-D384-ZZZZ,60-XX-D428-ZZZZ,60-XX-5791-ZZZZ,65-00-YYYY-ZZZZ,60-XX-D419-ZZZZ,T650,60-XX-D385-ZZZZ,60-XX-D391-ZZZZ,T636,T635,60-XX-D394-ZZZZ,G580,TC50,60-XX-D397-ZZZZ,60-XX-D378-ZZZZ,60-XX-D375-ZZZZ,60-XX-D425-ZZZZ,1641,65-5P-CIP35-10452,60-XX-D422-ZZZZ,60-XX-D372-ZZZZ,60-XX-D403-ZZZZ,60-12-20267-TW10,GEL 37,6W-XX-1015-ZZZZZZ,60-XX-D373-ZZZZ,60-XX-D409-ZZZZ,PC07DM-7,60-XX-4661-ZZZZ,579KT,60-XX-D387-ZZZZ,60-XX-YYYY-ZZZZ,60-XX-D412-ZZZZ,65-00-1641-0000,60-XX-D388-ZZZZ,65-00-T644-0045,65-00-T644-0200,GEL 30,64-XX-YYYY-ZZZZ,60-XX-D374-ZZZZ,60-XX-D390-ZZZZ,60-XX-4659-ZZZZ,60-XX-D408-ZZZZ,T670,65-00-T642-0035,T405-R,60-XX-4374-ZZZZ,T418,60-XX-D424-ZZZZ,60-XX-D410-ZZZZ,GEL 45,T777,1642 65-00-1642-0000,60-XX-D413-ZZZZ,T414,T411,T412,1671,60-12-20266-TW10,60-XX-8531-ZZZZ,60-12-20269-TW10,60-XX-D407-ZZZZ,PAD 60,569PN,60-XX-5527-ZZZZ,65-XX-YYYYY-ZZZZ,60-XX-5442-ZZZZ,60-XX-D426-ZZZZ,569,65-00-CIP35-0200,65-00-CIP35-0045,T660,PAD30PN,HCS10,T725,60-XX-D370-ZZZZ,60-XX-D376-ZZZZ,67-XX-YYYY-ZZZZ,65-00-T642-0250,60-XX-8302-ZZZZ,T444,GEL 8010,T766-06,65-00-T646-0045,A569,65-01-1641-0000,60-XX-D423-ZZZZ,PAD30KT,60-XX-D392-ZZZZ,60-XX-4969-ZZZZ,T609,570,65-00-T646-0200,1678,1674,60-XX-D371-ZZZZ,974,60-XX-D399-ZZZZ,60-XX-D405-ZZZZ,579,60-XX-D401-ZZZZ,976,60-XX-D377-ZZZZ,65-00-CIP35-1200,65-00-T647-0200,65-00-T647-0045,60-XX-D393-ZZZZ,60-XX-D427-ZZZZ,65-00-T650-0160,T558,HCS10G,6W-XX-0909-ZZZZZZ,T710,T557,CIP 35,60-XX-D383-ZZZZ,A579,PAD60,60-XX-D386-ZZZZ,580,60-XX-D389-ZZZZ,A570,60-XX-D430-ZZZZ,GEL 25NS,60-XX-D411-ZZZZ,HCS10A,60-XX-D414-ZZZZ,60-12-20268-TW10,T441,60-XX-D380-ZZZZ,60-12-20265-TW10
More Version(s)THERM-A-GAP™ MCS30 Thermally Conductive Gap Filler Pad
September 2015 - Datasheet
HIGHLY CONFORMABLE/LOW SILICONE EXTRACTABLE THERMAL PAD,导热间隙填料垫,高适形/低硅可萃取热垫,THERMALLY CONDUCTIVE GAP FILLER PAD,69-11-20687-MCS30X,MCS30,THERM-A-GAP™ MCS30,69-11-20684-MCS30X,69-11-20685-MCS30X,69-11-20698-MCS30X,69-11-20686-MCS30X,69-11-20672-MCS30X,69-11-20991-MCS30X,69-11-20675-MCS30X,69-11-27072-MCS30X,MCS 30,69-11-21259-MCS30X,69-11-27102-MCS30X,69-11-20913-MCS30X
Shenzhen Goldlink Tongda Electronics Co., Ltd THERMAL SOLUTION AND SERVICE
Company Profile Low Density Thermally Conductivity Silicone Gel Pad/Stressless Silicone Thermal Putty Gel Thermal Pad Thermal Silicone Pad & Silicone Thermal Fiberglass/Film EMI absorber/Absorption Gel Two-part Liquid Thermal Gap Pad/PCMs/Non-Silicone Sealing Compound Silicone/Non-Silicone Thermal grease Silicone Thermal Tape Graphite Thermal radiation Pad/Vibration Dampening Silicone Pad
2017/2/23 - Selection guide 低密度导热硅凝胶垫,NON-SILICONE THERMAL TAPE,NON-SILICONE THERMAL GREASE,LOW DENSITY THERMAL GAP PAD FOR EV BMS,ELECTROSTATIC DISCHARGE THERMAL SILICONE PAD,热间隙垫,硅酮热膜,减振硅胶垫,硅橡胶热垫,NON-SILICONE THERMAL FIBERGLASS,非硅酮热玻璃纤维,无硅密封剂,热腻子凝胶,PRINTABLE PCM THERMAL LNTERFACE MATERIAL,热界面相变材料,导热电磁干扰吸收软垫,SILICONE THERMAL FIBERGLASS,无应力硅酮热腻子凝胶,脉冲编码调制系统,EML吸收器,非硅酮热敏带,EMI ABSORBER,石墨热辐射垫,热EMI吸收凝胶,用于电动汽车BMS的低密度热间隙衬垫,THERMALLY CONDUCTIVE INSULATOR,非硅酮热垫,THERMALLY CONDUCTIVE EMI ABSORBER,双组分热界面密封剂,静电放电散热硅胶垫,THERMAL CONDUCTIVE SILICONE GEL PAD,SILICONE RUBBER THERMAL PAD,导热粘合剂,THERMAL FIBERGLASS,THERMAL INTERFACE PHASE CHANGE MATERIALS,PRINTABLE PCM THERMAL INTERFACE MATERIAL,ELECTROSTATIC DISCHARGE THERMAL GAP PAD,可印刷PCM热界面材料,GRAPHITE THERMAL RADIATION PAD,非硅酮热润滑脂,非硅酮腻子凝胶,THERMAL EMI ABSORPTION GEL,THERMAL PUTTY GEL,NON-SILICONE THERMAL PAD,SILICONE RUBBERTHERMAL PAD,SILICONE THERMAL PUTTY PAD,两部分液体热间隙垫,硅酮热垫,导热绝缘体,两部分可分配热垫,硅热玻璃纤维,SILICONE FREE SEALING COMPOUND,硅酮热腻子垫,STRESSLESS SILICONE THERMAL PUTTY GEL,THERMAL GREASE,NON-SILICONE THERMAL GREASE,SILICONE THERMAL PAD,PHASE CHANGE MATERIALS,静电放电热间隙垫,SILICONE THERMAL FILM,热界面润滑脂,EML ABSORBER,热玻璃纤维,SILICONE THERMAL TAPE,热导率EML吸收体PCM,THERMAL CONDUCTIVITY EMI ABSORBER SOFT PAD,TWO-PART THERMAL INTERFACE SEALING COMPOUND,导热硅凝胶垫,THERMAL GAP PAD,硅酮热敏带,THERMALLY CONDUCTIVE ADHESIVE,PCMS,非硅酮密封剂,VIBRATION DAMPENING SILICONE PAD,硅热凝胶,SILICONE PUTTY PAD,THERMAL CONDUCTIVITY EMI ABSORBER,非硅酮型,硅热润滑脂,NON-SILICONE SEALING COMPOUND,导热EMI吸收材料,TWO-PART DISPENSABLE THERMAL PAD,TWO-PART LIQUID THERMAL GAP PAD,THERMAL LNTERFACE GREASE,散热膏,THERMAL INTERFACE GREASE,NON-SILICONE PUTTY GEL,硅酮腻子垫,THERMAL CONDUCTIVITY EML ABSORBER PCM,NON-SILICONE TYPE,相变材料,导热EMI吸收凝胶,SILICONE THERMAL GREASE,THERMALLY CONDUCTIVE EMI ABSORPTION GEL,SILICONE THERMAL GEL,LOW DENSITY THERMALLY CONDUCTIVITY SILICONE GEL PAD,XK-G20E,XK-P20系列,XK-R系列,XK-P PUTTY,XK-PN50,XK-Z系列,XK-P20LD,XK-P80,XK-RE SERIES,XK-RAY310,XK-A100,XK-FN系列,XK-F系列,XK-FN,XK-FN20,XK-J系列,XK-C35D,XK-C35C,XK-PN45,XK-GN SERIES,XK-Z,XK-FST,XK-F35,XK-R30,XK-Z SERIES,XK-F10ST,XK-FN10,XK-P PUTTY SERIES,XK-FN15,XK-FST系列,XK-SF SERIES,XK-P45-PUTTY,XK-GN20,XK-Z15,XK-RE系列,XK-FN50,XK-X SERIES,XK-T SERIES,XK-G40,XK-F20,XK-J20,XK-SF35,XK-XN40,XK-P60,XK-RAY,XK-J25,XK-FST SERIES,XK-C系列,XK-SN SERIES,XK-R20,XK-G系列,XK-PN系列,XK-K系列,XK-TN08,XK-GN15,XK-XN系列,XK-SN系列,XK-FN40,XK-XN50,XK-G30,XK-S15LV,XK-F10,XK-C35,XK-PN60,XK-S30LV,XK-TN,XK-J10,XK-P50,XK-F15,XK-A SERIES,XK-TN12,XK-PS SERIES,XK-R10,XK-J18,XK-X50,XK-SF系列,XK-R15,XK-P30S20,XK-A80,XK-A60,XK-P系列,XK-PLD SERIES,XK-P20 SERIES,XK-PN15,XK-T系列,XK-P50-PUTTY,XK-C20,XK-X系列,XK-G20,XK-S20LV,XK-C25,XK-PLD,XK-SN,XK-SF15,XK-GEL 100,XK-SF18,XK-SN10,XK-P45,XK-PS系列,XK-P80-P,XK-SF,XK-K4,XK-X40,XK-TN SERIES,XK-F20ST,XK-K6,XK-P20S,XK-F SERIES,XK-GN30,XK-J SERIES,XK-S12LV,XK-C15,XK-C16,XK-P PUTTY 系列,XK-K10,XK-P15LD,XK-G15,XK-P50-P,XK-P30,XK-SN20,XK-P SERIES,XK-P80-PUTTY,XK-RE,XK-PN SERIES,XK-C,XK-TN系列,XK-G,XK-F,XK-F60,XK-R SERIES,XK-S25LV,XK-PN30,XK-A,XK-P20S20,XK-R,XK-A系列,XK-T,XK-R10E9,XK-PLD系列,XK-P20,BETA GEL 100,XK-X,XK-P25,XK-K,XK-J,XK-P45-P,XK-RAY SERIES,XK-P,XK-G SERIES,XK-PN,XK-T09,XK-A30,XK-PS,XK-F50,XK-F15ST,XK-C SERIES,XK-PN20,XK-K SERIES,XK-XN,XK-XN10,XK-XN SERIES,XK-RAY 系列,XK-P10LD,XK-FN SERIES,XK-R50,XK-GN系列,XK-T12,XK-GN,XK-ANFC,XK-X10
Thermal Gel 21-340B
2022 Jun. - Datasheet
THERMAL GEL,THERMAL MANAGEMENT MATERIAL,热凝胶,SOFT, SINGLE PART, SILICONE PUTTY THERMAL GAP FILLER,热管理材料,软质、单件、硅酮腻子热填缝剂,21-340B-080-25KG,21-3XX-AB-YYY,21-340B,21-340B-010-800G
Choosing the Right Thermal Pad: Thermal Conductivity & Hardness Explained
2024-12-17 - Technical Discussion Selecting the right thermal pad is essential for effective thermal management in electronic devices. Two critical performance factors to consider are thermal conductivity and hardness. In this article, Sheen will explore how these properties influence thermal pad performance and device longevity.
Thermal Gel 21-361-SP01
2022 Feb - Datasheet
THERMAL GEL,热凝胶,SOFT, SINGLE PART, SILICONE PUTTY THERMAL GAP FILLER,软质、单件、硅酮腻子热填缝剂,21-3XX-001-YYY,21-361-SP01-001-300M,21-361-SP01,21-361-SP01-001-005G
Electronic Mall
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization