Boyd Acquires Sensata’s Thermal Test and Controls Business
San Jose, California – July 1, 2022 – Boyd， AAVID's（爱美达）parent company, a world-leading innovator of technologies in engineered materials and thermal management, announced it acquired Sensata’s Thermal Test and Controls Business (NYSE: ST).
This business specializes in the design and manufacturing of advanced thermal control systems, adapters, and sockets critical to the thermal test process for high-end logic and memory semiconductors. With a long history of serving leading global semiconductor companies, the addition complements Boyd’s existing thermal business, which includes air and liquid-cooled thermal management technologies.
Boyd designs and manufactures complex thermal solutions for high-performance semiconductors used in applications such as 5G, hyperscale data center, eMobility, and artificial intelligence. With this acquisition, Boyd expands its offering to current semiconductor customers by adding advanced controls and thermal test systems essential to the production of high-end memory and logic devices.
“This acquisition is a natural fit for Boyd and adds to our portfolio of thermal solutions for leading semiconductor companies,” said Boyd CEO Doug Britt. “The advanced technologists, material scientists, and solutions from Sensata’s Thermal Test and Controls Business broaden Boyd’s presence in the rapidly growing semiconductor industry.”
The acquired business will operate under the Boyd brand – which has delivered Trusted Innovation for nearly 100 years. We have closed our acquisition of the business, except for in Korea, which is pending customary regulatory approval.
- +1 Like
- Add to Favorites
Recommend
- Thermal Grizzly CPU Contact Frame Intel 1700 LT is Now Available
- Thermal Grizzly Product Update: AM5 High-Performance Heatspreader with New Nickel Plating
- Important Note: Extension of Compatibility for AMD Products for the Ryzen 9000 Launch
- Ryzen Direct Die Frames V2: How the DDF is made
- New products: Heatspreader ＆ Mycro Direct Die for Intel CPUs
- Compatibility Changes for the Launch of AMD Ryzen 8X00G APUs
- New: The WireView Pro GPU
- The Intel Mycro Direct-Die Pro RGB V1 Direct-Die Water Cooler—Evolution of The Mycro Direct-Die Series for The Intel Lga1700 Platform
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
