Compatibility Changes for the Launch of AMD Ryzen 8X00G APUs
AMD has launched the desktop APUs of the 8000G series and these were promptly delidded and measured by Roman "der8auer" Hartung. The main difference between the Ryzen 8000G APUs and the Ryzen 7000 CPUs is that the 8X00G APUs only have one chip on the package. This CPU die is located in the middle of the PCB and is smaller in the Z-axis, i.e. the height, than the chips on the 7000 CPUs.
The shape of the heatspreader has not changed. It has only been made slightly thicker on the contact surface with the die to ensure contact. Unlike the soldered CPUs of the 7000 series, there is thermal paste as TIM (Thermal Interface Material) between the chip and the heatspreader.
Compatibility notes:
The change to the compatibility notes affects the following CPUs/APUs:
AMD Ryzen 5 8500G
AMD Ryzen 5 8600G
AMD Ryzen 7 8700G
These are compatible with the following thermal grizzly products:
Ryzen 7000 Delid-Die-Mate
Ryzen 7000 Lapping Tool
AM5 Contact & Sealing Frame
Our following products are incompatible with Ryzen 8X00G:
AM5 High Performance Heatspreader
Ryzen 7000 Mycro Direct Die
AMD Ryzen 7000 Direct Die Frame
Is it worth delidding the Ryzen 8X00G APUs?
Roman not only measured the APU, a Ryzen 8700G but also tested various Thermal Grizzly products for compatibility. The Ryzen 7000 Delid-Die-Mate can be used to delid the APUs of the Ryzen 8X00G series, as the external dimensions have hardly changed. The same applies to the Ryzen 7000 Lapping Tool.
Significant temperature advantages can be achieved when delivering the CPU. Roman was able to measure a reduction in temperature of up to 11 degrees Celsius with the KryoSheet compared to the stock APU. With Conductonaut Extreme, temperature drops of over 15 degrees Celsius were measured in places compared to the undelidded variant. The test was carried out in Cinebench R23 with a 360mm AiO.
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