EMSC Wire-bondable or embedded low profile Si Capdown to 100 μm
Thanks to the unique Murata* Silicon capacitor technology, most of the problems encountered in demanding applications can be solved. The wire bondable or embedded low profile Silicon Capacitors are available with thicknesses of 100 μm (down to 80 μm on request) and are the most appropriate solution for embedded applications, when designers are looking at utmost decoupling behaviours. EMSC are optimized for laminate substrate package, rigid / flex PCB, FR4, ceramic, glass, leadframe or foil platforms.
The Silicon capacitor technology offers a capacitor integration capability (up to 250 nF / mm²) which allows downsizing compared with existing solutions. The Murata technology features high reliability, up to 10 times better than alternative capacitor technologies, such as Tantalum or MLCC, and eliminates cracking phenomena. Silicon Capacitor technology also offers a very stable capacitor value over the full operating voltage & temperature range, with a high and stable insulation resistance. This Silicon based technology is ROHS compliant and can be compatible with lead free reflow soldering process.
●Key features:
■Ultra Low profile 100 μm (80 μm on request).
■High stability (temperature, voltage and aging).
■Low ESL and ESR.
■Low leakage current.
■High reliability.
■Embedding or wire-bonding solutions
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935123730510-xxA 、 935123421610-xxA 、 935123733610-xxA 、 935123422622-xxA 、 935123424710-xxA |
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[ medical ][ aerospace ][ automotive industrial ][ active device ][ embedded ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/04/23 |
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Rev 4.4 |
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1 MB |
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